SIGC06T60EX1SA2

SIGC06T60EX1SA2
Mfr. #:
SIGC06T60EX1SA2
Hersteller:
Infineon Technologies
Beschreibung:
IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC06T60EX1SA2)
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
SIGC06T60EX1SA2 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Tags
SIGC06T6, SIGC06, SIGC0, SIGC, SIG
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ineon
The TRENCHSTOP IGBT combines the unique TRENCHSTOP and Fieldstop technology and is a benchmark in the industry. | Summary of Features: Low turn-off losses; Short tail current; Positive temperature coefficient; Easy paralleling | Target Applications: Industrial drives
Teil # Mfg. Beschreibung Aktie Preis
SIGC06T60EX1SA2
DISTI # SIGC06T60EX1SA2
Infineon Technologies AGIGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC06T60EX1SA2)
RoHS: Compliant
Min Qty: 557
Container: Waffle Pack
Americas - 0
  • 557:$0.6459
  • 559:$0.6229
  • 1116:$0.5999
  • 2785:$0.5799
  • 5570:$0.5699
Bild Teil # Beschreibung
SIGC06T120CSX1SA3

Mfr.#: SIGC06T120CSX1SA3

OMO.#: OMO-SIGC06T120CSX1SA3-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC06T120CSX1SA3)
SIGC06T60EX1SA2

Mfr.#: SIGC06T60EX1SA2

OMO.#: OMO-SIGC06T60EX1SA2-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC06T60EX1SA2)
SIGC06T60GEX1SA2

Mfr.#: SIGC06T60GEX1SA2

OMO.#: OMO-SIGC06T60GEX1SA2-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC06T60GEX1SA2)
SIGC06T65EX1SA1

Mfr.#: SIGC06T65EX1SA1

OMO.#: OMO-SIGC06T65EX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC06T65EX1SA1)
SIGC06T65GEX1SA1

Mfr.#: SIGC06T65GEX1SA1

OMO.#: OMO-SIGC06T65GEX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC06T65GEX1SA1)
Verfügbarkeit
Aktie:
Available
Auf Bestellung:
2500
Menge eingeben:
Der aktuelle Preis von SIGC06T60EX1SA2 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Referenzpreis (USD)
Menge
Stückpreis
ext. Preis
1
0,85 $
0,85 $
10
0,81 $
8,12 $
100
0,77 $
76,94 $
500
0,73 $
363,30 $
1000
0,68 $
683,90 $
Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
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