658-45ABT4E

Mfr. #:: 658-45ABT4E
Hersteller:: Wakefield-Vette
Beschreibung:: Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T410R
Lebenszyklus:: Neu von diesem Hersteller.
Datenblatt:: 658-45ABT4E Datenblatt
Die Zustellung:: DHL FedEx Ups TNT EMS
Zahlung:: T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:: 658-45ABT4E Datasheet
ECAD Model:

Produkteigenschaft
Attributwert

Hersteller:: Wakefield-Vette

Produktkategorie:: Temperatur fällt

RoHS:: Y

Produkt:: Temperatur fällt

Montageart:: Klebstoff

Kühlkörpermaterial:: Aluminium

Flossenstil:: Omnidirektionale Flosse

Länge:: 27.94 mm

Breite:: 27.94 mm

Höhe:: 11.43 mm

Designed für:: BGA, Super-BGA, PBGA, FPBGA, PowerPC

Farbe:: Schwarz

Serie:: 658

Typ:: Obere Halterung

Marke:: Wakefield-Vette

Produktart:: Temperatur fällt

Werkspackungsmenge:: 1000

Unterkategorie:: Temperatur fällt

Tags: 658-45ABT, 658-45, 658-4, 658

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

658-45ABT4E Beschreibung

***roFlash: 658 Series 27.9 x 27.9 x 11.4 mm 6° C/W Resistance Omnidirectional Heat Sink

***(Formerly Allied Electronics): Omnidirectional Pin Fin Heat Sink for 27mm BGA & Power PC

***ical: Heat Sink Passive BGA Pin Array Adhesive Black Anodized

***i-Key: HEATSINK CPU 28MM SQ BLK W/TAPE

***ow.cn: Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 16.1°C/W Black Anodized

***ter Electronics: Type: Top mount / Shape: Square Pin fin / Length: 1.31 /

***i-Key: HEATSINK CPU W/ADHESIVE 1.31"SQ

***ure Electronics: Black Anodised 30.73 x 30.73 x 14.4mm 16.5°C/W Adhesive Peel and Stick Heat Sink

***et: Heat Sink Passive Pin Array Adhesive 16.5°C/W Black Anodized

***i-Key: HEATSINK CPU W/ADHESIVE 1.21"SQ

***ical: Heat Sink Passive Pin Array Adhesive Tape 19.6C/W Black Anodized

***ure Electronics: Heatsink CPU W/Adhesive 1.21"SQ

***ure Electronics: BGA 23.4 C/W Thermal Resistance 23 x 23 x 18 mm Black Anodized Heatsink

***(Formerly Allied Electronics): Heatsink, BGA, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil Mount

***nell: HEATSINK, BGA; Thermal Resistance: 23.4°C/W; Packages Cooled: BGA; External Width - Metric: 23mm; External Height - Metric: 18mm; External Length - Metric: 23mm; External Diameter - Metric: -; Heat Sink Material: Aluminium; External Width - Imperial: 0.9"; External Height - Imperial: 0.7"; External Length - Imperial: 0.9"; External Diameter - Imperial: -; Product Range: -; SVHC: No SVHC (15-Jan-2019)

***er Electronics: Heat Sinks Slide-On, Heat Sink w/Attach-On, DIPS, Straight Fin, Horizontal, 34C/W, 31.75mm

***ure Electronics: Black Anodize Extruded Epoxy Straight Fins Attach on DIP-24 Heatsink

***et: Heat Sink Passive DIP Straight Extruded Epoxy 34°C/W Black Anodized

***i-Key: HEATSINK 24-PIN DIP GLUE-ON BLK

***ark: 508500B00000G ROHS COMPLIANT: YES

***ure Electronics: 27 x 27 x 18mm 20.3 C/W Thermal Resistance Peel-Stick Assembly PIN FIN Heat Sink

***(Formerly Allied Electronics): Heatsink, BGA, 20.3K/W, 27 x 27 x 18mm, Adhesive Foil Mount

***ical: Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 20.3C/W Black Anodized

***nell: HEAT SINK BGA 27 X 27 X 18 WITH PAD; Thermal Resistance: 20.3°C/W; Packages Cooled: BGA; External Width - Metric: 27mm; External Height - Metric: 18mm; External Length - Metric: 27mm; External Diameter - Metric: -; Heat Sink Material: Aluminium; External Width - Imperial: 1.06"; External Height - Imperial: 0.71"; External Length - Imperial: 1.06"; External Diameter - Imperial: -; Product Range: -; SVHC: No SVHC (15-Jan-2018)

Market price

Teil #	Mfg.	Beschreibung	Aktie	Preis
658-45ABT4E DISTI # 33953995	Wakefield-Vette	Heat Sink Passive BGA Pin Array Adhesive Black Anodized	451	30:$2.1500
658-45ABT4E DISTI # 345-1110-ND	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE RoHS: Compliant Min Qty: 1 Container: Bulk	276In Stock	5000:$1.6097 1000:$1.6413 500:$1.8306 250:$1.8938 100:$2.0200 50:$2.1462 25:$2.2724 10:$2.3360 1:$2.4000
658-45ABT4E DISTI # 70663558	Wakefield-Vette	Omnidirectional Pin Fin Heat Sink for 27mm BGA & Power PC RoHS: Compliant	0	1000:$2.3400 2000:$2.2200 5000:$2.0700 10000:$1.9900
658-45ABT4E DISTI # 567-658-45ABT4E	Wakefield-Vette	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T410R RoHS: Compliant	0	1:$2.3900 10:$2.3300 25:$2.2700 50:$2.1400 100:$2.0200 250:$1.8900 500:$1.8300 1000:$1.6400
658-45ABT4E	Wakefield-Vette	Heat Sink Passive BGA Pin Array Adhesive Black Anodized RoHS: Compliant	465 In Stock	1:$2.0700 25:$1.9700 100:$1.8700 500:$1.7800
658-45ABT4E DISTI # 658-45ABT4E	Wakefield-Vette	BOARD LEVEL HEAT SINK RoHS: Compliant	0
658-45ABT4E DISTI # 65845ABT4E	Wakefield-Vette		465	1:$2.0700 25:$1.9700 100:$1.8700 500:$1.7800 1000:$1.6900 2500:$1.6000 5000:$1.2100 10000:$0.9600
658-45AB-T4E DISTI # 000000000002133281	Wakefield-Vette	Heat Sink Passive BGA Pin Array Adhesive Black Anodized	3225	1:$2.1700 40:$2.1000 200:$1.9200 400:$1.8400

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Verfügbarkeit

Aktie:: 990
Auf Bestellung:: 2973
Menge eingeben:

Der aktuelle Preis von 658-45ABT4E dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]

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658-45ABT4E

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes