SIGC156T60NR2CX1SA4

SIGC156T60NR2CX1SA4
Mfr. #:
SIGC156T60NR2CX1SA4
Hersteller:
Infineon Technologies
Beschreibung:
Trans IGBT Chip N-CH 600V DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC156T60NR2CX1SA4)
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
SIGC156T60NR2CX1SA4 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Tags
SIGC156T6, SIGC156, SIGC15, SIGC1, SIGC, SIG
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et Europe
Trans IGBT Chip N-CH 600V 200A DIE Wafer
***et
Trans IGBT Chip N-CH 600V DIE
***i-Key
IGBT 3 CHIP 600V WAFER
***ineon
Infineon's IGBT 2 family is a non punch-through IGBT technology with low switching losses and high robustness. | Summary of Features: Positive temperature coefficient; Easy paralleling; High robustness | Target Applications: Industrial drives
Teil # Mfg. Beschreibung Aktie Preis
SIGC156T60NR2CX1SA4
DISTI # SIGC156T60NR2CX1SA4
Infineon Technologies AGTrans IGBT Chip N-CH 600V DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC156T60NR2CX1SA4)
RoHS: Compliant
Min Qty: 26
Container: Waffle Pack
Americas - 0
  • 260:$12.5900
  • 130:$12.7900
  • 78:$13.2900
  • 52:$13.7900
  • 26:$14.2900
SIGC156T60NR2CX1SA4
DISTI # SP000012818
Infineon Technologies AGTrans IGBT Chip N-CH 600V DIE (Alt: SP000012818)
RoHS: Compliant
Min Qty: 1
Europe - 0
  • 1000:€10.9900
  • 500:€11.0900
  • 100:€11.2900
  • 50:€11.3900
  • 25:€12.0900
  • 10:€12.1900
  • 1:€12.5900
Bild Teil # Beschreibung
SIGC156T60NR2CX1SA4

Mfr.#: SIGC156T60NR2CX1SA4

OMO.#: OMO-SIGC156T60NR2CX1SA4-1190

Trans IGBT Chip N-CH 600V DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC156T60NR2CX1SA4)
SIGC156T60NR2CYX1SA1

Mfr.#: SIGC156T60NR2CYX1SA1

OMO.#: OMO-SIGC156T60NR2CYX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC156T60NR2CYX1SA1)
SIGC156T60SNR2CX1SA1

Mfr.#: SIGC156T60SNR2CX1SA1

OMO.#: OMO-SIGC156T60SNR2CX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC156T60SNR2CX1SA1)
Verfügbarkeit
Aktie:
Available
Auf Bestellung:
2000
Menge eingeben:
Der aktuelle Preis von SIGC156T60NR2CX1SA4 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Referenzpreis (USD)
Menge
Stückpreis
ext. Preis
1
18,73 $
18,73 $
10
17,80 $
177,96 $
100
16,86 $
1 685,97 $
500
15,92 $
7 961,50 $
1000
14,99 $
14 986,40 $
Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
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