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A15896-04

A15896-04
Mfr. #:
A15896-04
Hersteller:
Laird Technologies - Thermal Materials
Beschreibung:
THERM PAD 228.6MMX228.6MM GRAY
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
A15896-04 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
A15896-04 Datasheet
ECAD Model:
Produkteigenschaft
Attributwert
Tags
A15896-0, A15896, A1589, A158, A15
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***er Electronics
Thermal Interface Products Tflex 740 9x9 5.0W/mK gap filler
***i-Key
THERM PAD 228.6MMX228.6MM GRAY
***ark
Thermal Gap Filler, 229 X 229Mm, 1Mm; Thermal Conductivity:5W/m.k; Conductive Material:silicone; Thickness:1Mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229Mm; External Width:229Mm; Product Range:tflex Hr600 Rohs Compliant: Yes
***ment14 APAC
Prices include import duty and tax. THERMAL GAP FILLER, 229 X 229MM, 1MM; Thermal Conductivity:5W/m.K; Conductive Material:Silicone; Thickness:1mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product Range:Tflex HR600 Series; SVHC:No SVHC (15-Jan-2018); Insulator Body Material:Silicone; Volume Resistivity:100000Mohm-m
***nell
FOGLIO TERMICO, 229 X 229MM, 1MM; Conducibilità Termica:5W/m.K; Materiale Conduttivo:Silicone; Spessore:1mm; Impedenza Termica:-; Rigidità Dielettrica:-; Lunghezza Esterna:229mm; Larghezza Esterna:229mm; Gamma Prodotti:Tflex HR600 Series; Sostanze Estremamente Preoccupanti (SVHC):No SVHC (15-Jan-2018); Materiale Corpo Isolante:Silicone; Resistività Volumetrica:100000Mohm-m
Teil # Mfg. Beschreibung Aktie Preis
A15896-04
DISTI # 926-1143-ND		LAIRD PLCTHERM PAD 228.6MMX228.6MM GRAY
RoHS: Compliant
Min Qty: 1
Container: Bulk		227In Stock
  • 100:$75.6210
  • 50:$78.5296
  • 25:$81.4380
  • 10:$87.2550
  • 1:$93.0700
A15896-04
DISTI # 52Y0863		LAIRD PLCTHERMAL GAP FILLER, 229 X 229MM, 1MM,Thermal Conductivity:5W/m.K,Conductive Material:Silicone,Thickness:1mm,Thermal Impedance:-,Dielectric Strength:-,External Length:229mm,External Width:229mm,Product Range:Tflex HR600 RoHS Compliant: Yes2
  • 50:$91.4100
  • 25:$95.9400
  • 10:$95.9800
  • 5:$99.1700
  • 1:$102.3700
A15896-04
DISTI # 739-A15896-04		Laird Performance MaterialThermal Interface Products Tflex 740 9x9" 5.0W/mK gap filler
RoHS: Compliant		22
  • 1:$93.0600
  • 10:$87.2500
  • 25:$87.2200
  • 50:$83.1000
A15896-04
DISTI # 2484752		LAIRD PLCTHERMAL GAP FILLER, 229 X 229MM, 1MM
RoHS: Compliant		15
  • 100:$115.4000
  • 50:$119.8400
  • 25:$124.2800
  • 10:$133.1600
  • 1:$142.0200
A15896-04
DISTI # 000000000002763643		LAIRD PLCThermal Interface Products Tflex 740 9x9 5.0W/mK gap filler0
    A15896-04
    DISTI # 2484752    		LAIRD PLCTHERMAL GAP FILLER, 229 X 229MM, 1MM
    RoHS: Compliant    		12
    • 25:£64.0000
    • 10:£76.5500
    • 5:£86.7600
    • 1:£103.0000
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    Verfügbarkeit
    Aktie:
    Available
    Auf Bestellung:
    2500
    Menge eingeben:
    Der aktuelle Preis von A15896-04 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
    Referenzpreis (USD)
    Menge
    Stückpreis
    ext. Preis
    1
    112,74 $
    112,74 $
    10
    107,10 $
    1 071,04 $
    100
    101,47 $
    10 146,71 $
    500
    95,83 $
    47 915,00 $
    1000
    90,19 $
    90 193,00 $
    Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
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