2-176771-2

2-176771-2
Mfr. #:
2-176771-2
Hersteller:
TE Connectivity
Beschreibung:
Board to Board & Mezzanine Connectors 1.25FP,P22,DS,O N,TU,10.0,11.9
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
2-176771-2 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Tags
2-1767, 2-176, 2-17, 2-1
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
Teil # Mfg. Beschreibung Aktie Preis
2-176771-2
DISTI # 2-176771-2-ND
TE Connectivity LtdCONN HEADER SMD 22POS 1.25MM
RoHS: Compliant
Min Qty: 9000
Container: Tube
Temporarily Out of Stock
  • 9000:$0.6403
2-176771-2
DISTI # 571-2-176771-2
TE Connectivity LtdBoard to Board & Mezzanine Connectors 1.25FP,P22,DS,O N,TU,10.0,11.9
RoHS: Compliant
0
    Bild Teil # Beschreibung
    2-1761465-4

    Mfr.#: 2-1761465-4

    OMO.#: OMO-2-1761465-4

    PCI Express / PCI Connectors PCI EXPRESS RA ASSY 5.8MM SLOT 2.3MM PC
    2-1761603-6

    Mfr.#: 2-1761603-6

    OMO.#: OMO-2-1761603-6

    Headers & Wire Housings PIN HEADER 16 POS VERT LOW PROFILE
    2-1761603-8

    Mfr.#: 2-1761603-8

    OMO.#: OMO-2-1761603-8

    Headers & Wire Housings IDC CONNECTOR
    2-1761603-9

    Mfr.#: 2-1761603-9

    OMO.#: OMO-2-1761603-9

    Headers & Wire Housings IDC LOW PRO HDR 26P VERT BLUE
    2-176793-4

    Mfr.#: 2-176793-4

    OMO.#: OMO-2-176793-4-TE-CONNECTIVITY

    D-Sub Backshells 050 SHIELD CASE 26P
    2-1761714-6

    Mfr.#: 2-1761714-6

    OMO.#: OMO-2-1761714-6-TE-CONNECTIVITY

    Headers & Wire Housings IDC LOW PRO HDR 16P RA SHT LAT BLUE
    2-1761679-7

    Mfr.#: 2-1761679-7

    OMO.#: OMO-2-1761679-7-TE-CONNECTIVITY

    Headers & Wire Housings PIN HEADER 20 POS VERT LOW PROFILE
    2-1761712-3

    Mfr.#: 2-1761712-3

    OMO.#: OMO-2-1761712-3-TE-CONNECTIVITY

    Headers & Wire Housings IDC LOW PRO HDR 10P RA LG LAT BLUE
    2-1761607-1

    Mfr.#: 2-1761607-1

    OMO.#: OMO-2-1761607-1-TE-CONNECTIVITY

    Headers & Wire Housings IDC LOW PRO HDR 6P RA LG LAT BLUE
    2-1761606-6

    Mfr.#: 2-1761606-6

    OMO.#: OMO-2-1761606-6-TE-CONNECTIVITY

    Headers & Wire Housings 100X100 HDR 2X008P VRT LPRO
    Verfügbarkeit
    Aktie:
    Available
    Auf Bestellung:
    2500
    Menge eingeben:
    Der aktuelle Preis von 2-176771-2 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
    Referenzpreis (USD)
    Menge
    Stückpreis
    ext. Preis
    1
    0,00 $
    0,00 $
    10
    0,00 $
    0,00 $
    100
    0,00 $
    0,00 $
    500
    0,00 $
    0,00 $
    1000
    0,00 $
    0,00 $
    Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
    Beginnen mit
    Neueste Produkte
    • Z-PACK HM-eZd+ Backplane Connectors
      TE Connectivity's HM-eZd+ backplane connectors enhance electrical performance at true 25 Gbps speeds and are backward compatible with existing HM-Zd connectors.
    • Modular Jack Connectors
      TE Connectivity's comprehensive single-port modular jack connectors are designed for the data communications market, suiting applications that require performance in high-speed networking.
    • Automotive Relays
      TE Connectivity's high-performing plug-in relays are available in make, changeover, double make, and bridging make contact arrangements.
    Top