HMC554ALC3BTR

HMC554ALC3BTR
Mfr. #:
HMC554ALC3BTR
Hersteller:
Analog Devices Inc.
Beschreibung:
IC MMIC MIXER DBL-BAL 12SMD
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
HMC554ALC3BTR Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Mehr Informationen:
HMC554ALC3BTR Mehr Informationen HMC554ALC3BTR Product Details
Produkteigenschaft
Attributwert
Tags
HMC554A, HMC554, HMC55, HMC5, HMC
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ical
Up/Down Conv Mixer 20GHz 12-Pin CLLCC EP T/R
***i-Key
IC MMIC MIXER DBL-BAL 12SMD
RF, Microwave & Millimeter Wave ADI SLP
Teil # Mfg. Beschreibung Aktie Preis
HMC554ALC3BTR-R5
DISTI # V72:2272_21654078
Analog Devices IncUp/Down Conv Mixer 20GHz T/R480
  • 250:$50.5000
  • 100:$52.7400
  • 25:$58.8800
  • 10:$62.8300
  • 1:$68.2600
HMC554ALC3BTR
DISTI # V72:2272_18536738
Analog Devices IncGaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz42
  • 25:$58.8800
  • 10:$62.8300
  • 1:$68.2600
HMC554ALC3BTR
DISTI # V36:1790_18536738
Analog Devices IncGaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz0
    HMC554ALC3BTR-R5
    DISTI # V36:1790_21654078
    Analog Devices IncUp/Down Conv Mixer 20GHz T/R0
      HMC554ALC3BTR
      DISTI # HMC554ALC3BTR-ND
      Analog Devices IncIC MMIC MIXER DBL-BAL 12SMD
      RoHS: Compliant
      Min Qty: 100
      Container: Tape & Reel (TR)
      Temporarily Out of Stock
      • 100:$42.0261
      HMC554ALC3BTR-R5
      DISTI # HMC554ALC3BTR-R5-ND
      Analog Devices IncIC MMIC MIXER DBL-BAL 12SMD
      RoHS: Compliant
      Min Qty: 500
      Container: Tape & Reel (TR)
      Temporarily Out of Stock
      • 500:$37.2631
      HMC554ALC3BTR-R5
      DISTI # 30670702
      Analog Devices IncUp/Down Conv Mixer 20GHz T/R480
      • 250:$53.7930
      • 100:$56.4913
      • 25:$63.3068
      • 10:$67.5208
      • 1:$73.3473
      HMC554ALC3BTR
      DISTI # 32135562
      Analog Devices IncGaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz42
      • 25:$63.3068
      • 10:$67.5208
      • 1:$73.3473
      HMC554ALC3B
      DISTI # 584-HMC554ALC3B
      Analog Devices IncRF Mixer Mixers
      RoHS: Compliant
      97
      • 1:$49.6600
      • 5:$48.2500
      • 10:$46.3300
      • 25:$43.0000
      • 50:$43.0000
      • 100:$40.2300
      HMC554ALC3BTR
      DISTI # 584-HMC554ALC3BTR
      Analog Devices IncRF Mixer Mixers
      RoHS: Compliant
      0
      • 100:$40.2300
      • 200:$38.8400
      HMC554ALC3BTR-R5
      DISTI # 584-HMC554ALC3BTR-R5
      Analog Devices IncRF Mixer Mixers
      RoHS: Compliant
      0
      • 500:$36.9000
      Bild Teil # Beschreibung
      HMC554ALC3B

      Mfr.#: HMC554ALC3B

      OMO.#: OMO-HMC554ALC3B

      RF Mixer Mixers
      HMC554ALC3BTR-R5

      Mfr.#: HMC554ALC3BTR-R5

      OMO.#: OMO-HMC554ALC3BTR-R5

      RF Mixer Mixers
      HMC554

      Mfr.#: HMC554

      OMO.#: OMO-HMC554

      RF Mixer GaAs MMIC DBL-BAL mix Chip, 11 - 20 GHz
      HMC554LC3B-AN

      Mfr.#: HMC554LC3B-AN

      OMO.#: OMO-HMC554LC3B-AN-283

      RF Mixer GaAs MMIC DBL-BAL mix SMT11 - 20 GHz
      HMC554-SX

      Mfr.#: HMC554-SX

      OMO.#: OMO-HMC554-SX-ANALOG-DEVICES

      IC MMIC MIXER DBL-BAL DIE
      HMC554ALC3B

      Mfr.#: HMC554ALC3B

      OMO.#: OMO-HMC554ALC3B-ANALOG-DEVICES

      IC MMIC MIXER DBL-BAL 12SMD
      HMC554ALC3BTR

      Mfr.#: HMC554ALC3BTR

      OMO.#: OMO-HMC554ALC3BTR-ANALOG-DEVICES

      IC MMIC MIXER DBL-BAL 12SMD
      HMC554ALC3BTR-R5

      Mfr.#: HMC554ALC3BTR-R5

      OMO.#: OMO-HMC554ALC3BTR-R5-ANALOG-DEVICES

      IC MMIC MIXER DBL-BAL 12SMD
      HMC554LC3

      Mfr.#: HMC554LC3

      OMO.#: OMO-HMC554LC3-1190

      Neu und Original
      HMC554LC3BE

      Mfr.#: HMC554LC3BE

      OMO.#: OMO-HMC554LC3BE-1190

      Neu und Original
      Verfügbarkeit
      Aktie:
      Available
      Auf Bestellung:
      1000
      Menge eingeben:
      Der aktuelle Preis von HMC554ALC3BTR dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
      Referenzpreis (USD)
      Menge
      Stückpreis
      ext. Preis
      1
      58,26 $
      58,26 $
      10
      55,35 $
      553,47 $
      100
      52,43 $
      5 243,40 $
      500
      49,52 $
      24 760,50 $
      1000
      46,61 $
      46 608,00 $
      Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
      Beginnen mit
      Neueste Produkte
      • Hearing Protection
        3M's hearing protection products are some of the most recognized on the market and are designed to provide protection, comfort, and ease of use.
      • ZIP DIP Sockets
        With decades of experience on the market, 3M™ ZIP DIP sockets provide a proven, reliable test and burn-in interface for DIP Packages with .100" lead spacing, and pin counts of 14 to 64.
      • Thermally Conductive Epoxy Adhesive TC-2810
        3M™'s TC-2810 is a thermally conductive 2-part epoxy using boron nitride (BN) filler for good thermal conductivity with high adhesion.
      • 451 Series Socket Assemblies and 452 Series Board-
        3M™'s 451 series ribbon cable socket assemblies and the 452 series shrouded board-mount headers offer a current rating of 1.0 A.
      • Connector Headers and Ejectors for CFast™
        3M™'s headers and ejectors for CFast are geared towards markets where performance and system downtime are major considerations.
      Top