1035-2-17-80-30-27-02-0

1035-2-17-80-30-27-02-0
Mfr. #:
1035-2-17-80-30-27-02-0
Hersteller:
Mill-Max
Beschreibung:
IC & Component Sockets 200u SN OVER NI 30 CON 2 WRAPS
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
1035-2-17-80-30-27-02-0 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
1035-2-17-80-30-27-02-0 Datasheet
ECAD Model:
Produkteigenschaft
Attributwert
Hersteller:
Mühle-Max
Produktkategorie:
IC- und Komponentensockel
RoHS:
Y
Produkt:
Buchsenstifte
Serie:
1035
Verpackung:
Schüttgut
Marke:
Mühle-Max
Produktart:
IC- und Komponentensockel
Werkspackungsmenge:
500
Unterkategorie:
IC- und Komponentensockel
Tags
1035-2-17-8, 1035-2, 1035, 103
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***er Electronics
Contact SKT 30 Size Press Fit ST Thru-Hole Bulk
***i-Key
CONN PIN RCPT
Teil # Mfg. Beschreibung Aktie Preis
1035-2-17-80-30-27-02-0
DISTI # V99:2348_06455822
Mill-Max Mfg CorpContact SKT Press Fit ST Thru-Hole Bulk
RoHS: Compliant
0
  • 15000:$0.5223
  • 10000:$0.5498
  • 5000:$0.5788
  • 3000:$0.6092
  • 1000:$0.6413
1035-2-17-80-30-27-02-0
DISTI # 1035-2-17-80-30-27-02-0-ND
Mill-Max Mfg CorpCONN PIN RCPT
RoHS: Compliant
Min Qty: 1000
Container: Bulk
Temporarily Out of Stock
  • 1000:$0.6413
1035-2-17-80-30-27-02-0
DISTI # 575-1035217803027
Mill-Max Mfg CorpIC & Component Sockets 200u SN OVER NI 30 CON 2 WRAPS
RoHS: Compliant
0
  • 1:$0.8000
  • 10:$0.7610
  • 100:$0.7210
  • 500:$0.6810
1035-2-17-01-30-27-02-0
DISTI # 575-1035217013027
Mill-Max Mfg CorpIC & Component Sockets 200u SN/PB OVER NI 30 CON 2 WRAPS
RoHS: Not compliant
0
  • 1:$0.8000
  • 10:$0.7610
  • 100:$0.7210
  • 500:$0.6410
1035-2-17-80-30-27-02-0
DISTI # 000000000001644410
Mill-Max Mfg CorpContact SKT 30 Size Press Fit ST Thru-Hole Bulk0
  • 1000:$0.9022
  • 2500:$0.4380
  • 5000:$0.2558
  • 10000:$0.1685
Bild Teil # Beschreibung
1035-2-17-80-30-27-02-0

Mfr.#: 1035-2-17-80-30-27-02-0

OMO.#: OMO-1035-2-17-80-30-27-02-0

IC & Component Sockets 200u SN OVER NI 30 CON 2 WRAPS
1035-2-17-80-30-84-020

Mfr.#: 1035-2-17-80-30-84-020

OMO.#: OMO-1035-2-17-80-30-84-020-1190

Neu und Original
1035-2-17-80-30-84-02-0

Mfr.#: 1035-2-17-80-30-84-02-0

OMO.#: OMO-1035-2-17-80-30-84-02-0-MILL-MAX

IC & Component Sockets 200u SN OVER NI 30 CON 2 WRAPS
1035-2-17-80-30-27-02-0

Mfr.#: 1035-2-17-80-30-27-02-0

OMO.#: OMO-1035-2-17-80-30-27-02-0-MILL-MAX

IC & Component Sockets 200u SN OVER NI 30 CON 2 WRAPS
Verfügbarkeit
Aktie:
Available
Auf Bestellung:
5000
Menge eingeben:
Der aktuelle Preis von 1035-2-17-80-30-27-02-0 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Beginnen mit
Neueste Produkte
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    Mill-Max's solder cup components simplify the task of making wired connections between PCBs or devices and PCBs.
  • 802 Series Shrouded Headers
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  • Shrouded Male Connectors
    Mill-Max's 2 mm pitch shrouded male pin connectors are available in 3 terminations styles, through-hole or surface mount options, and are RoHS-compliant.
  • Mezzanine Connectors
    Mill-Max's 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections conform to EIA-700 AAAB for IEEE 1386 applications.
  • 0861 and 0871 Spring Pins
    Mill-Max's 0861 and 0871 spring pins, designed for rugged applications, offer excellent signal integrity in shock and vibration environments.
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