101-93-306-41-560000

101-93-306-41-560000
Mfr. #:
101-93-306-41-560000
Hersteller:
Mill-Max
Beschreibung:
IC & Component Sockets DIP SKT CLINCH PIN OPEN FRAME
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
101-93-306-41-560000 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
101-93-306-41-560000 Datasheet
ECAD Model:
Produkteigenschaft
Attributwert
Hersteller
Mill-Max Manufacturing Corp.
Produktkategorie
Sockel für ICs, Transistoren
Serie
101
Typ
DIP, 0.3" (7.62mm) Row Spacing
Verpackung
Rohr
Beendigung
Lot
Betriebstemperatur
-55°C ~ 125°C
Befestigungsart
Durchgangsloch
Merkmale
Offener Rahmen
Gehäuse-Material
Polycyclohexylendimethylenterephthalat (PCT), Polyester
Anzahl-von-Positionen-oder-Pins-Raster
6 (2 x 3)
Pitch-Mating
0.100" (2.54mm)
Kontakt-Finish-Paarung
Gold
Pitch-Post
0.100" (2.54mm)
Kontakt-Finish-Post
Zinn-Blei
Kontakt-Finish-Dicke-Paarung
30μin (0.76μm)
Kontakt-Material-Paarung
Berylliumkupfer
Kontakt-Finish-Dicke-Post
200μin (5.08μm)
Kontakt-Material-Post
Messinglegierung
Tags
101-93-3, 101-93, 101-9, 101
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***er Electronics
Conn DIP Socket SKT 6 POS 2.54mm Solder ST Thru-Hole Tube
***i-Key
CONN IC DIP SOCKET 6POS GOLD
Teil # Mfg. Beschreibung Aktie Preis
101-93-306-41-560000
DISTI # 10193-30641560000-ND
Mill-Max Mfg CorpCONN IC DIP SOCKET 6POS GOLD
RoHS: Not compliant
Min Qty: 67
Container: Tube
Temporarily Out of Stock
  • 67:$12.9169
101-93-306-41-560000
DISTI # 575-10193306415600
Mill-Max Mfg CorpIC & Component Sockets DIP SKT CLINCH PIN OPEN FRAME
RoHS: Not compliant
0
  • 134:$5.0900
101-93-306-41-560000
DISTI # 000000000000037046
Mill-Max Mfg CorpConn DIP Socket SKT 6 POS 2.54mm Solder ST Thru-Hole Tube0
  • 50:$14.3500
  • 100:$8.3500
  • 250:$4.3400
  • 500:$2.8200
Bild Teil # Beschreibung
101-93-306-41-560000

Mfr.#: 101-93-306-41-560000

OMO.#: OMO-101-93-306-41-560000-MILL-MAX

IC & Component Sockets DIP SKT CLINCH PIN OPEN FRAME
Verfügbarkeit
Aktie:
Available
Auf Bestellung:
2000
Menge eingeben:
Der aktuelle Preis von 101-93-306-41-560000 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Referenzpreis (USD)
Menge
Stückpreis
ext. Preis
1
4,23 $
4,23 $
10
4,02 $
40,18 $
100
3,81 $
380,70 $
500
3,60 $
1 797,75 $
1000
3,38 $
3 384,00 $
Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
Beginnen mit
Neueste Produkte
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    Mill-Max's solder cup components simplify the task of making wired connections between PCBs or devices and PCBs.
  • 802 Series Shrouded Headers
    Mill-Max's 802 series of shrouded male pin connectors are available in 4 to 64 pin configurations and are ideal for applications with blind mate conditions.
  • Compare 101-93-306-41-560000
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  • Shrouded Male Connectors
    Mill-Max's 2 mm pitch shrouded male pin connectors are available in 3 terminations styles, through-hole or surface mount options, and are RoHS-compliant.
  • Mezzanine Connectors
    Mill-Max's 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections conform to EIA-700 AAAB for IEEE 1386 applications.
  • 0861 and 0871 Spring Pins
    Mill-Max's 0861 and 0871 spring pins, designed for rugged applications, offer excellent signal integrity in shock and vibration environments.
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