658-60ABT3

Mfr. #:: 658-60ABT3
Hersteller:: Wakefield-Vette
Beschreibung:: Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T412
Lebenszyklus:: Neu von diesem Hersteller.
Datenblatt:: 658-60ABT3 Datenblatt
Die Zustellung:: DHL FedEx Ups TNT EMS
Zahlung:: T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:: 658-60ABT3 Datasheet
ECAD Model:

Produkteigenschaft
Attributwert

Hersteller:: Wakefield-Vette

Produktkategorie:: Temperatur fällt

RoHS:: Y

Produkt:: Temperatur fällt

Montageart:: Klebstoff

Kühlkörpermaterial:: Aluminium

Flossenstil:: Omnidirektionale Flosse

Länge:: 27.94 mm

Breite:: 27.94 mm

Höhe:: 15.24 mm

Designed für:: BGA, Super-BGA, PBGA, FPBGA, PowerPC

Farbe:: Schwarz

Serie:: 658

Typ:: Obere Halterung

Marke:: Wakefield-Vette

Produktart:: Temperatur fällt

Werkspackungsmenge:: 700

Unterkategorie:: Temperatur fällt

Gewichtseinheit:: 0.499832 oz

Tags: 658-60ABT, 658-6, 658

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

658-60ABT3 Beschreibung

***er Electronics: Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Aluminum, Chomerics T412

***(Formerly Allied Electronics): Heatsink; Omnidirectional; 15.2mm; Black Anodized; with Tape

***ure Electronics: 658 Series 27.9 x 27.9 x 15.2 mm 2° C/W Resistance Omnidirectional Heat Sink

***ical: Heat Sink Passive BGA Pin Array Adhesive Black Anodized

***ser: BGA Heatsink 28mm OMNIDIRECTIONAL

***i-Key: HEATSINK CPU 28MM SQ BLK W/TAPE

***: HEAT SINK 28MM OMNIDIRECTIONAL

***ark: Heat Sink; Thermal Resistance:-; Packages Cooled:bga; External Width - Metric:27.9Mm; External Height - Metric:15.24Mm; External Length - Metric:28Mm; External Diameter - Metric:-; Heat Sink Material:-; External Width - Imperial:1.1"rohs Compliant: Yes

***ure Electronics: Black Anodised 30.73 x 30.73 x 14.4mm 16.5°C/W Adhesive Peel and Stick Heat Sink

***et: Heat Sink Passive Pin Array Adhesive 16.5°C/W Black Anodized

***i-Key: HEATSINK CPU W/ADHESIVE 1.21"SQ

***ure Electronics: BGA 23.4 C/W Thermal Resistance 23 x 23 x 18 mm Black Anodized Heatsink

***(Formerly Allied Electronics): Heatsink, BGA, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil Mount

***nell: HEATSINK, BGA; Thermal Resistance: 23.4°C/W; Packages Cooled: BGA; External Width - Metric: 23mm; External Height - Metric: 18mm; External Length - Metric: 23mm; External Diameter - Metric: -; Heat Sink Material: Aluminium; External Width - Imperial: 0.9"; External Height - Imperial: 0.7"; External Length - Imperial: 0.9"; External Diameter - Imperial: -; Product Range: -; SVHC: No SVHC (15-Jan-2019)

***ical: Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.4C/W Black Anodized

***i-Key: HEATSINK CPU W/ADHESIVE 1.01"SQ

***et: Heat Sink Passive Pin Array Adhesive Tape 20.9°C/W Black Anodized

***i-Key: HEATSINK CPU W/ADHESIVE 1.11"SQ

***el Nordic: Contact for details

***ure Electronics: 27 x 27 x 18mm 20.3 C/W Thermal Resistance Peel-Stick Assembly PIN FIN Heat Sink

***(Formerly Allied Electronics): Heatsink, BGA, 20.3K/W, 27 x 27 x 18mm, Adhesive Foil Mount

***ical: Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 20.3C/W Black Anodized

***nell: HEAT SINK BGA 27 X 27 X 18 WITH PAD; Thermal Resistance: 20.3°C/W; Packages Cooled: BGA; External Width - Metric: 27mm; External Height - Metric: 18mm; External Length - Metric: 27mm; External Diameter - Metric: -; Heat Sink Material: Aluminium; External Width - Imperial: 1.06"; External Height - Imperial: 0.71"; External Length - Imperial: 1.06"; External Diameter - Imperial: -; Product Range: -; SVHC: No SVHC (15-Jan-2018)

***er Electronics: Heat Sinks Slide-On, Heat Sink w/Attach-On, DIPS, Straight Fin, Horizontal, 34C/W, 31.75mm

***ure Electronics: Black Anodize Extruded Epoxy Straight Fins Attach on DIP-24 Heatsink

***et: Heat Sink Passive DIP Straight Extruded Epoxy 34°C/W Black Anodized

***i-Key: HEATSINK 24-PIN DIP GLUE-ON BLK

***ark: 508500B00000G ROHS COMPLIANT: YES

Market price

Teil #	Mfg.	Beschreibung	Aktie	Preis
658-60ABT3 DISTI # 31957005	Wakefield-Vette	658-60ABT3	2146	28:$2.3000
658-60ABT3 DISTI # 345-1075-ND	Wakefield-Vette	HEATSINK CPU 28MM SQ BLK W/TAPE RoHS: Compliant Min Qty: 1 Container: Bulk	2929In Stock	5000:$1.6354 1000:$1.6675 500:$1.8599 250:$1.9240 100:$2.0523 50:$2.1806 25:$2.3088 10:$2.3730 1:$2.4400
658-60ABT3 DISTI # 52F4988	Wakefield-Vette	HEAT SINK,Thermal Resistance:-,Packages Cooled:BGA,External Width - Metric:27.9mm,External Height - Metric:15.2mm,External Length - Metric:27.9mm,External Diameter - Metric:-,Heat Sink Material:-,Product Range:-,Colour:BlackRoHS Compliant: Yes	0	1000:$1.9100 500:$2.1100 250:$2.1800 100:$2.3100 50:$2.4500 25:$2.5800 10:$2.6500 1:$2.7200
658-60ABT3 DISTI # 70236703	Wakefield-Vette	Heatsink,Omnidirectional,15.2mm,Black Anodized,with Tape RoHS: Compliant	603	1:$3.1400 10:$2.5000 100:$2.2000 500:$2.0700
658-60ABT3 DISTI # 567-658-60ABT3	Wakefield-Vette	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T412 RoHS: Compliant	0	1:$2.4300 10:$2.3700 25:$2.3000 50:$2.1800 100:$2.0500 250:$1.9200 500:$1.8600 1000:$1.6600
658-60ABT3	Wakefield-Vette	Heat Sink Passive BGA Pin Array Adhesive Black Anodized RoHS: Compliant	2211 In Stock	1:$2.2100 25:$2.1000 100:$2.0000 500:$1.9000
658-60ABT3	Wakefield-Vette		1
658-60ABT3 DISTI # 000000000000798918	Wakefield-Vette	Heat Sink Passive BGA Pin Array Adhesive Black Anodized	0	1:$2.2100 39:$2.1300 197:$1.9500 394:$1.8700
658-60ABT3 DISTI # 65860ABT3	Wakefield-Vette		2211	1:$2.2100 25:$2.1000 100:$2.0000 500:$1.9000 700:$1.8000 1000:$1.7100 1400:$1.6300 2800:$1.2300

Verwandte Produkte

Bild	Teil #	Beschreibung
	Mfr.#: 658-60ABT1E OMO.#: OMO-658-60ABT1E	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T405R
	Mfr.#: 658-60ABT2 OMO.#: OMO-658-60ABT2	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized
	Mfr.#: 658-60ABT5 OMO.#: OMO-658-60ABT5	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, 15.2mm Height, Chomerics T411
	Mfr.#: 658-60ABT3 OMO.#: OMO-658-60ABT3	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T412
	Mfr.#: 658-60ABT1 OMO.#: OMO-658-60ABT1	Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T405
	Mfr.#: 658-60AB OMO.#: OMO-658-60AB-WAKEFIELD	Heat Sink Passive BGA Pin Array Adhesive Black Anodized
	Mfr.#: 658-60ABT2 OMO.#: OMO-658-60ABT2-WAKEFIELD	HEATSINK CPU 28MM SQ BLK W/TAPE
	Mfr.#: 658-60ABT3 OMO.#: OMO-658-60ABT3-WAKEFIELD	HEATSINK CPU 28MM SQ BLK W/TAPE
	Mfr.#: 658-60ABT5 OMO.#: OMO-658-60ABT5-WAKEFIELD	HEATSINK EXTRUSION 27MM
	Mfr.#: 658-60ABT6 OMO.#: OMO-658-60ABT6-WAKEFIELD	HEATSINK EXTRUSION 27MM

Verfügbarkeit

Aktie:: Available
Auf Bestellung:: 1984
Menge eingeben:

Der aktuelle Preis von 658-60ABT3 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]

Beginnen mit

658-60ABT 9
658-6 10
658 1001

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658-60ABT3

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes