EP3C80F780C8N

EP3C80F780C8N
Mfr. #:
EP3C80F780C8N
Hersteller:
Intel / Altera
Beschreibung:
FPGA - Field Programmable Gate Array FPGA - Cyclone III 5079 LABs 429 IOs
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
EP3C80F780C8N Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
EP3C80F780C8N DatasheetEP3C80F780C8N Datasheet (P4-P6)EP3C80F780C8N Datasheet (P7-P9)EP3C80F780C8N Datasheet (P10-P12)EP3C80F780C8N Datasheet (P13-P14)
ECAD Model:
Mehr Informationen:
EP3C80F780C8N Mehr Informationen EP3C80F780C8N Product Details
Produkteigenschaft
Attributwert
Hersteller:
Intel
Produktkategorie:
FPGA - Feldprogrammierbares Gate-Array
RoHS:
Y
Produkt:
Zyklon III
Anzahl der Logikelemente:
81264
Anzahl der Logik-Array-Blöcke - LABs:
5079
Anzahl I/Os:
429 I/O
Betriebsversorgungsspannung:
1.15 V to 1.25 V
Minimale Betriebstemperatur:
0 C
Maximale Betriebstemperatur:
+ 70 C
Montageart:
SMD/SMT
Paket / Koffer:
FBGA-780
Verpackung:
Tablett
Serie:
Cyclone III EP3C80
Marke:
Intel / Altera
Maximale Betriebsfrequenz:
315 MHz
Feuchtigkeitsempfindlich:
ja
Produktart:
FPGA - Feldprogrammierbares Gate-Array
Werkspackungsmenge:
36
Unterkategorie:
Programmierbare Logik-ICs
Gesamtspeicher:
2810880 bit
Handelsname:
Zyklon III
Gewichtseinheit:
0.419760 oz
Tags
EP3C80F780C8, EP3C80F780C, EP3C80F7, EP3C80F, EP3C8, EP3C, EP3
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et Europe
FPGA Cyclone® III Family 81264 Cells 402MHz 65nm Technology 1.2V 780-Pin F-BGA
***akorn
FPGA Cyclone® III Family 81264 Cells 402MHz 65nm Technology 1.2V 780-Pin FBGA
***p One Stop Global
FPGA Cyclone III Family 81264 Cells 402MHz 65nm Technology 1.2V 780-Pin FBGA
***ark
FIELD PROGRAMMABLE GATE ARRAY FPGA; ;ROHS COMPLIANT: YES
*** Source Electronics
IC FPGA 429 I/O 780FBGA
***ment14 APAC
Prices include import duty and tax. FPGA, CYCLONE III, 80K LE, 780FBGA; No. of Logic Blocks:5079; No. of Macrocells:-; FPGA Family:Cyclone III; Logic Case Style:BGA; No. of Pins:780Pins; No. of Speed Grades:-; Total RAM Bits:2810880Kbit; No. of I/O's:295I/O's; Clock Management:-; Core Supply Voltage Min:1.15V; Core Supply Voltage Max:1.25V; I/O Supply Voltage:3.3V; Operating Frequency Max:402MHz; Product Range:-; MSL:-; SVHC:No SVHC (17-Dec-2015); Core Supply Voltage Range:1.15V to 1.25V; Frequency:402.5MHz; I/O Interface Standard:HSTL, LVCMOS, LVD, LVPECL, LVTTL, PCI, PCI-X, SSTL; Logic Function Number:3C80F780; Logic IC Base Number:3; Logic IC Function:FPGA; Operating Temperature Max:85°C; Operating Temperature Min:0°C; Operating Temperature Range:0°C to +85°C; Programmable Logic Type:FPGA; Termination Type:Surface Mount Device
***nell
FPGA, CYCLONE III, 80K LE, 780FBGA; Liczba bloków logicznych:5079; Liczba bloków Macrocell:-; Rodzina FPGA:Cyclone III; Typ obudowy układu logicznego IC:BGA; Liczba pinów:780piny/-ów; Liczba stopni prędkości:-; Całkowity rozmiar RAM, bity:2810880Kbit; Liczba wejść/wyjść:295I/O; Zarządzanie zegarem:-; Min. napięcie zasilające rdzenia:1.15V; Maks. napięcie zasilające rdzenia:1.25V; Napięcie zasilające I/O:3.3V; Częstotliwość robocza, maks.:402MHz; Asortyment produktów:-; Wskaźnik wrażliwości na wilgoć MSL:-; Substancje SVHC:No SVHC (17-Dec-2015); Częstotliwość:402.5MHz; Funkcja układu logicznego IC:FPGA; Numer funkcji logicznej:3C80F780; Numer podstawowy układu logicznego IC:3; Opakowanie:Każdy osobno; Rodzaj logiki programowalnej:FPGA; Standard interfejsu I/O:HSTL, LVCMOS, LVD, LVPECL, LVTTL, PCI, PCI-X, SSTL; Temperatura robocza, maks.:85°C; Temperatura robocza, min.:0°C; Typ zakończenia:Do montażu powierzchniowego; Zakres napięcia zasilania rdzenia:1.15V do 1.25V
Cyclone® III FPGAs
Altera Cyclone® III FPGAs offer an unprecedented combination of low power, high functionality, and low cost to maximize your competitive edge. The features and architecture of the Altera Cyclone III FPGA family provides the ideal solution for your high-volume, low-power, cost-sensitive applications. With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. To address your unique design needs, this FPGA family offers two variants: Cyclone III provides the lowest power and high functionality with the lowest cost. Cyclone III LS provides the lowest power FPGAs with security.Learn More
Cyclone® Family FPGAs
Intel Cyclone® Family FPGAs are built to meet your low-power, cost-sensitive design needs, enabling you to get to market faster. Each generation of Cyclone FPGAs solves the technical challenges of increased integration, increased performance, lower power, and faster time to market while meeting cost-sensitive requirements. Intel Cyclone V FPGAs provide the market's lowest system cost and lowest power FPGA solution for applications in the industrial, wireless, wireline, broadcast, and consumer markets. The family integrates an abundance of hard intellectual property (IP) blocks to enable you to do more with less overall system cost and design time. The SoC FPGAs in the Cyclone V family offer unique innovations such as a hard processor system (HPS) centered around the dual-core ARM® Cortex™-A9 MPCore™ processor with a rich set of hard peripherals to reduce system power, system cost, and board size. Intel Cyclone IV FPGAs are the lowest cost, lowest power FPGAs, now with a transceiver variant. The Cyclone IV FPGA family targets high volume, cost-sensitive applications, enabling you to meet increasing bandwidth requirements while lowering costs. Intel Cyclone III FPGAs offer an unprecedented combination of low cost, high functionality, and power optimization to maximize your competitive edge. The Cyclone III FPGA family is manufactured using Taiwan Semiconductor Manufacturing Company's low-power process technology to deliver low power consumption at a price that rivals that of ASICs. Intel Cyclone II FPGAs are built from the ground up for low cost and to provide a customer-defined feature set for high volume, cost-sensitive applications. Intel Cyclone II FPGAs deliver high performance and low power consumption at a cost that rivals that of ASICs.Learn More
Teil # Mfg. Beschreibung Aktie Preis
EP3C80F780C8N
DISTI # V99:2348_07396837
Intel CorporationFPGA Cyclone® III Family 81264 Cells 402MHz 65nm Technology 1.2V 780-Pin FBGA26
  • 1:$307.1200
EP3C80F780C8N
DISTI # V36:1790_07396837
Intel CorporationFPGA Cyclone® III Family 81264 Cells 402MHz 65nm Technology 1.2V 780-Pin FBGA1
  • 1:$307.1200
EP3C80F780C8N
DISTI # 544-2525-ND
Intel CorporationIC FPGA 429 I/O 780FBGA
RoHS: Compliant
Min Qty: 1
Container: Tray
20In Stock
  • 1:$307.1200
EP3C80F780C8N
DISTI # 25865189
Intel CorporationFPGA Cyclone® III Family 81264 Cells 402MHz 65nm Technology 1.2V 780-Pin FBGA26
  • 1:$307.1200
EP3C80F780C8N
DISTI # 27521113
Intel CorporationFPGA Cyclone® III Family 81264 Cells 402MHz 65nm Technology 1.2V 780-Pin FBGA1
  • 1:$307.1200
EP3C80F780C8N
DISTI # 989-EP3C80F780C8N
Intel CorporationFPGA - Field Programmable Gate Array FPGA - Cyclone III 5079 LABs 429 IOs
RoHS: Compliant
27
  • 1:$307.1200
EP3C80F780C8N
DISTI # C1S112300088553
Altera CorporationFPGA Cyclone III Family 81264 Cells 402MHz 65nm Technology 1.2V 780-Pin FBGA
RoHS: Compliant
26
  • 1:$307.1200
Bild Teil # Beschreibung
TLV9001IDCKR

Mfr.#: TLV9001IDCKR

OMO.#: OMO-TLV9001IDCKR

Operational Amplifiers - Op Amps SINGLE CHANNEL AMP
TLV9001IDPWR

Mfr.#: TLV9001IDPWR

OMO.#: OMO-TLV9001IDPWR

Operational Amplifiers - Op Amps OPAMP
MCP2517FD-H/SL

Mfr.#: MCP2517FD-H/SL

OMO.#: OMO-MCP2517FD-H-SL

CAN Interface IC Stand-alone CAN FD Controller w/SPI Interface
SSA12

Mfr.#: SSA12

OMO.#: OMO-SSA12-TE-CONNECTIVITY

Slide Switches SPDT 2POS STR AG T/H SLIDE SWITCH
MCP2517FD-H/SL

Mfr.#: MCP2517FD-H/SL

OMO.#: OMO-MCP2517FD-H-SL-MICROCHIP-TECHNOLOGY

STAND-ALONE CAN FD CONTROLLER W
IRM-03-12

Mfr.#: IRM-03-12

OMO.#: OMO-IRM-03-12-MEAN-WELL

AC/DC Power Supply Single-OUT 12V 0.25A 3W 5-Pin
TLV9001IDCKR

Mfr.#: TLV9001IDCKR

OMO.#: OMO-TLV9001IDCKR-TEXAS-INSTRUMENTS

1-CHANNEL, 1MHZ, RRIO, 1.8V TO 5
TLV9001IDPWR

Mfr.#: TLV9001IDPWR

OMO.#: OMO-TLV9001IDPWR-TEXAS-INSTRUMENTS

Low-Power, Rail-to-Rail In and Out, 1-MHz Operational Amplifie
RK73H1JTTD1072F

Mfr.#: RK73H1JTTD1072F

OMO.#: OMO-RK73H1JTTD1072F-1090

Thick Film Resistors - SMD 1/10watts 10.7Kohms
RK73H1JTTD4700F

Mfr.#: RK73H1JTTD4700F

OMO.#: OMO-RK73H1JTTD4700F-1090

Thick Film Resistors - SMD 1/10watts 470ohms 1%
Verfügbarkeit
Aktie:
36
Auf Bestellung:
2019
Menge eingeben:
Der aktuelle Preis von EP3C80F780C8N dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Referenzpreis (USD)
Menge
Stückpreis
ext. Preis
1
307,12 $
307,12 $
Beginnen mit
Neueste Produkte
  • Cyclone® IV GX Transceiver Development Kit
    The Cyclone® IV GX transceiver starter kit from Intel® provides a low-cost platform for developing transceiver I/O-based FPGA designs.
  • Compare EP3C80F780C8N
    EP3C80F780C8 vs EP3C80F780C8J vs EP3C80F780C8N
  • EM2280P01QI 80 A Digital PowerSoC
    The Intel® Enpirion® EM2280 integrates power switches, inductor, gate drive, controller, and compensation in a small 23 mm x 18 mm QFN package.
  • Cyclone® IV GX Starter Board
    The Cyclone® IV GX transceiver starter board from Intel® enables users to develop FPGA design for cost-sensitive applications.
  • Cyclone® V FPGA Family
    Cyclone® V FPGA family from Intel® features lower-power due to increased use of hard-IP-blocks.
  • HD30 Connectors
    TE Connectivity's DEUTSCH HD30 connectors are constructed from a rugged aluminum shell developed to meet the needs of the heavy-duty truck, bus, and off-highway industries.
Top