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3B31-03

3B31-03
Mfr. #:
3B31-03
Hersteller:
TDK Corporation of America
Beschreibung:
Other Modules
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
3B31-03 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Tags
3B31-0, 3B31, 3B3
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et Europe
Input/Output Subsystem 30-Pin
***i-Key
MODULE ISOL VOLT-IN +/-10V
***log Devices
The 3B Series Signal Conditioning I/O Subsystem provides a low cost, versatile method of interconnecting real world analog signals to a data acquisition, monitoring or control system. It is designed to interface directly to analog signals such as thermocouple, RTD, ac and dc Strain Gage, Torque Transducer, Frequency, LVDT, AD590/AC2626 solid state temperature sensor outputs, and millivolt or process current signals, and convert the inputs to standardized analog outputs compatible with high level analog I/O subsystems. The 3B Series Subsystem consists of a 19" relay rack, compatible universal mounting backplane and a family of plug-in input and output signal conditioning modules (up to 16 per rack). 8- and 4-channel backplanes are also available. Each backplane incorporates screw terminals for sensor inputs and current outputs and a connector for high level, single-ended outputs to the user’s equipment. Input and output modules are offered in both isolated (±1500 V peak) and nonisolated versions. The input modules feature complete signal conditioning circuitry optimized for specific sensors or analog signals, and provide high level analog outputs. Each input module provides two simultaneous outputs: 0 V to +10 V (or ±10 V) and 4–20 mA (or 0–20 mA). Output modules accept 0 V to +10 V (or ±10 V) single ended signals and provide an isolated or nonisolated 4–20 mA (or 0–20 mA) process signal. All modules feature a universal pinout and may be readily “mixed and matched” and interchanged without disrupting field wiring. Each backplane contains the provision for a subsystem power supply. The 3B Series Subsystem can operate either from a common dc/dc or ac power supply mounted on each backplane, or from externally provided dc power. Two LEDs are used to indicate that power is being applied.
Teil # Mfg. Beschreibung Aktie Preis
B32633B3103J10
DISTI # B32633B3103J010		TDK Corporation of AmericaCap Film 0.01uF 2500V PP 5% (27 X 14 X 23mm) Radial 22.5mm 100°C Bulk (Alt: B32633B3103J010)
RoHS: Compliant
Min Qty: 1000
Container: Bulk		Asia - 4000
  • 50000:$2.1474
  • 25000:$2.2254
  • 10000:$2.3094
  • 5000:$2.4480
  • 3000:$2.7200
  • 2000:$3.0600
  • 1000:$3.4971
3B31-03
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    		 MODULE ISOL THERMO-IN
    Verfügbarkeit
    Aktie:
    Available
    Auf Bestellung:
    5000
    Menge eingeben:
    Der aktuelle Preis von 3B31-03 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
    Referenzpreis (USD)
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    Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
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