SIGC04T60EX1SA2

SIGC04T60EX1SA2
Mfr. #:
SIGC04T60EX1SA2
Hersteller:
Infineon Technologies
Beschreibung:
IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC04T60EX1SA2)
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
SIGC04T60EX1SA2 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Tags
SIGC04T60, SIGC04, SIGC0, SIGC, SIG
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ineon
The TRENCHSTOP IGBT combines the unique TRENCHSTOP and Fieldstop technology and is a benchmark in the industry. | Summary of Features: Low turn-off losses; Short tail current; Positive temperature coefficient; Easy paralleling | Target Applications: Industrial drives
Teil # Mfg. Beschreibung Aktie Preis
SIGC04T60EX1SA2
DISTI # SIGC04T60EX1SA2
Infineon Technologies AGIGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC04T60EX1SA2)
RoHS: Compliant
Min Qty: 827
Container: Waffle Pack
Americas - 0
  • 8270:$0.3839
  • 4135:$0.3909
  • 2481:$0.4039
  • 1654:$0.4199
  • 827:$0.4349
Bild Teil # Beschreibung
SIGC04T60EX1SA2

Mfr.#: SIGC04T60EX1SA2

OMO.#: OMO-SIGC04T60EX1SA2-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC04T60EX1SA2)
SIGC04T60GEX1SA1

Mfr.#: SIGC04T60GEX1SA1

OMO.#: OMO-SIGC04T60GEX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC04T60GEX1SA1)
SIGC04T60GSEX1SA1

Mfr.#: SIGC04T60GSEX1SA1

OMO.#: OMO-SIGC04T60GSEX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC04T60GSEX1SA1)
SIGC04T65EX1SA1

Mfr.#: SIGC04T65EX1SA1

OMO.#: OMO-SIGC04T65EX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC04T65EX1SA1)
Verfügbarkeit
Aktie:
Available
Auf Bestellung:
2000
Menge eingeben:
Der aktuelle Preis von SIGC04T60EX1SA2 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Referenzpreis (USD)
Menge
Stückpreis
ext. Preis
1
0,58 $
0,58 $
10
0,55 $
5,47 $
100
0,52 $
51,83 $
500
0,49 $
244,75 $
1000
0,46 $
460,70 $
Beginnen mit
Neueste Produkte
  • IO-Link™ Devices
    Maxim Integrated’s complete portfolio of IO-link devices integrate value-adding features to provide design flexibility and offload the local processor.
  • Large Diameter Clear Hole Spacers
    RAF's large diameter clear hole spacers for industrial applications are available in standard stock sizes, various materials and finishes, and custom options.
  • WE-ExB Series Common Mode Power Line Choke
    Wurth's WE-ExB series is the double core made of MnZn and NiZn. Its insertion loss has a range of effect over a broader frequency range than does a single NiZn or MnZn core.
  • CPI2-B1-REU Production Device Programmer
    Phyton's CPI2-B1-REU in-system programmer supports Renesas microcontrollers, memory devices, and MCUs from other manufacturers.
  • CFSH05-20L Schottky Diode
    Central Semiconductor's space saving, low profile Schottky diode for applications including DC-DC conversion and circuit protection.
Top