EZLINX-IIIDE-EBZ

EZLINX-IIIDE-EBZ
Mfr. #:
EZLINX-IIIDE-EBZ
Hersteller:
Analog Devices Inc.
Beschreibung:
Interface Development Tools EZLINX EVAL BRD
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
EZLINX-IIIDE-EBZ Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
EZLINX-IIIDE-EBZ DatasheetEZLINX-IIIDE-EBZ Datasheet (P4-P6)EZLINX-IIIDE-EBZ Datasheet (P7-P9)EZLINX-IIIDE-EBZ Datasheet (P10-P12)EZLINX-IIIDE-EBZ Datasheet (P13-P15)EZLINX-IIIDE-EBZ Datasheet (P16-P18)EZLINX-IIIDE-EBZ Datasheet (P19-P20)
ECAD Model:
Mehr Informationen:
EZLINX-IIIDE-EBZ Mehr Informationen EZLINX-IIIDE-EBZ Product Details
Produkteigenschaft
Attributwert
Hersteller:
Analog Devices Inc.
Produktkategorie:
Schnittstellenentwicklungstools
Versandbeschränkungen:
RoHS:
Y
Produkt:
Entwicklungsboards
Typ:
iCoupler isoliert
Das Tool dient zur Bewertung von:
ADSP-BF548
Verpackung:
Schüttgut
Beschreibung/Funktion:
ezLINX iCoupler Evaluierungsboard mit isolierter Schnittstelle
Serie:
ADM3053
Marke:
Analoge Geräte
Oberflächentyp:
Seriennummer
Maximale Betriebstemperatur:
+ 85 C
Minimale Betriebstemperatur:
- 40 C
Betriebsversorgungsspannung:
1.2 V, 2.5 V, 3.3 V, 5 V
Produktart:
Schnittstellenentwicklungstools
Werkspackungsmenge:
1
Unterkategorie:
Entwicklungswerkzeuge
Gewichtseinheit:
1.268 lbs
Tags
EZL
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***p One Stop Japan
ezLINX iCoupler Isolated Interface Development Environment
***ark
Board, Icoupler Interface, Ezlinx
***Components
Analog Devices EZLINX-IIIDE-EBZ
***i-Key
BOARD EVAL EZLINKS ICOUPLER
***et Europe
EZLINX EVALUATION BOARD
***ment14 APAC
BOARD, ICOUPLER INTERFACE, EZLINX; Silicon Manufacturer:Analog Devices; Core Architecture:DSP; Silicon Core Number:ADSP-BF548; Silicon Family Name:Blackfin; Kit Contents:Development Board for ADSP-BF548, Power Supply, USB Cable; Features:iCoupler Isolated Interface, uCLinux Operating System
***nell
BOARD, ICOUPLER INTERFACE, EZLINX; Silicon Manufacturer:Analog Devices; Core Architecture:DSP; Core Sub-Architecture:(Not Available); Silicon Core Number:ADSP-BF548; Silicon Family Name:Blackfin; Kit Contents:Development Board for ADSP-BF548, Power Supply, USB Cable; Features:iCoupler Isolated Interface, uCLinux Operating System; SVHC:No SVHC (19-Dec-2012)
***log Devices
The ADM3053 is an isolated controller area network (CAN) physical layer transceiver with an integrated isolated dc-to-dc converter. The ADM3053 complies with the ISO 11898 standard. The device employs Analog Devices, Inc., iCoupler® technology to combine a 2-channel isolator, a CAN transceiver, and Analog Devices isoPower® dc-to-dc converter into a single SOIC surface mount package. An on-chip oscillator outputs a pair of square waveforms that drive an internal transformer to provide isolated power. The device is powered by a single 5 V supply realizing a fully isolated CAN solution. The ADM3053 creates a fully isolated interface between the CAN protocol controller and the physical layer bus. It is capable of running at data rates of up to 1 Mbps. The device has current limiting and thermal shutdown features to protect against output short circuits. The part is fully specified over the industrial temperature range and is available in a 20-lead, wide-body SOIC package. The ADM3053 contains isoPower technology that uses high frequency switching elements to transfer power through the transformer. Special care must be taken during printed circuit board (PCB) layout to meet emissions standards. Refer to the AN-0971 Application Note, Control of Radiated Emissions with isoPower Devices, for details on board layout considerations. Applications CAN data buses Industrial field networks
Teil # Mfg. Beschreibung Aktie Preis
EZLINX-IIIDE-EBZ
DISTI # V36:1790_06225413
Analog Devices IncezLINX iCoupler Isolated Interface Development Environment
RoHS: Compliant
0
    EZLINX-IIIDE-EBZ
    DISTI # EZLINX-IIIDE-EBZ-ND
    Analog Devices IncBOARD EVAL EZLINKS ICOUPLER
    RoHS: Compliant
    Container: Box
    Temporarily Out of Stock
      EZLINX-IIIDE-EBZ
      DISTI # 584-EZLINX-IIIDE-EBZ
      Analog Devices IncInterface Development Tools EZLINX EVAL BRD
      RoHS: Compliant
      3
      • 1:$146.8700
      Bild Teil # Beschreibung
      EVAL-ADM3053EBZ

      Mfr.#: EVAL-ADM3053EBZ

      OMO.#: OMO-EVAL-ADM3053EBZ

      Interface Development Tools EVAL-ADM3053
      EVAL-ADM3053EBZ

      Mfr.#: EVAL-ADM3053EBZ

      OMO.#: OMO-EVAL-ADM3053EBZ-ANALOG-DEVICES

      BOARD EVAL FOR ADM3053EBZ
      Verfügbarkeit
      Aktie:
      Available
      Auf Bestellung:
      1986
      Menge eingeben:
      Der aktuelle Preis von EZLINX-IIIDE-EBZ dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
      Beginnen mit
      Neueste Produkte
      • Hearing Protection
        3M's hearing protection products are some of the most recognized on the market and are designed to provide protection, comfort, and ease of use.
      • ZIP DIP Sockets
        With decades of experience on the market, 3M™ ZIP DIP sockets provide a proven, reliable test and burn-in interface for DIP Packages with .100" lead spacing, and pin counts of 14 to 64.
      • Thermally Conductive Epoxy Adhesive TC-2810
        3M™'s TC-2810 is a thermally conductive 2-part epoxy using boron nitride (BN) filler for good thermal conductivity with high adhesion.
      • 451 Series Socket Assemblies and 452 Series Board-
        3M™'s 451 series ribbon cable socket assemblies and the 452 series shrouded board-mount headers offer a current rating of 1.0 A.
      • Connector Headers and Ejectors for CFast™
        3M™'s headers and ejectors for CFast are geared towards markets where performance and system downtime are major considerations.
      Top