53553-1409

53553-1409
Mfr. #:
53553-1409
Hersteller:
Molex
Beschreibung:
Board to Board & Mezzanine Connectors VERT SMT PLUG 140P dual row stacking
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
53553-1409 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Hersteller:
Molex
Produktkategorie:
Board-to-Board- und Mezzanine-Steckverbinder
RoHS:
N
Produkt:
Buchsen
Anzahl der Positionen:
140 Position
Tonhöhe:
0.64 mm
Anzahl der Reihen:
2 Row
Abschlussart:
SMD/SMT
Montagewinkel:
Vertikal
Aktuelle Bewertung:
500 mA
Spannungswert:
100 V
Serie:
53553
Kontaktbeschichtung:
Gold
Gehäusematerial:
Thermoplast
Marke:
Molex
Kontaktmaterial:
Phosphorbronze
Maximale Betriebstemperatur:
+ 85 C
Minimale Betriebstemperatur:
- 55 C
Produktart:
Board-to-Board- und Mezzanine-Steckverbinder
Unterkategorie:
Board-to-Board- und Mezzanine-Steckverbinder
Handelsname:
SlimStack
Teil # Aliase:
0535531409
Gewichtseinheit:
0.070669 oz
Tags
53553-1, 53553, 5355, 535
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ser
SlimStack Connectors VERT SMT PLUG 140P dual row, stacking
***ex
0.635mm Pitch SlimStack™ Header, Surface Mount, Dual Row, Vertical Stacking, 10.00 and 16.00mm Stacking Heights, 140 Circuits, with Tube Packaging
***i-Key
CONN PLUG 140POS .635MM 10MM SMD
Teil # Mfg. Beschreibung Aktie Preis
53553-1409
DISTI # 53553-1409-ND
MolexCONN PLUG 140POS SMD GOLD
RoHS: Not compliant
Min Qty: 1
Container: Tube
Limited Supply - Call
    53553-1409
    DISTI # 538-53553-1409
    MolexBoard to Board & Mezzanine Connectors VERT SMT PLUG 140P dual row stacking
    RoHS: Not compliant
    0
      Bild Teil # Beschreibung
      52901-1474

      Mfr.#: 52901-1474

      OMO.#: OMO-52901-1474-418

      Board to Board & Mezzanine Connectors .635 RECEPTACLE SURFACE MNT 140 CKT
      52885-1474

      Mfr.#: 52885-1474

      OMO.#: OMO-52885-1474-418

      Board to Board & Mezzanine Connectors .635 RECEPTACLE SURFACE MNT 140 CKT
      Verfügbarkeit
      Aktie:
      Available
      Auf Bestellung:
      3000
      Menge eingeben:
      Der aktuelle Preis von 53553-1409 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
      Beginnen mit
      Neueste Produkte
      • MXMag Single-Port RJ45 Magnetic Jacks
        Molex’s MXMag RJ45 connectors are magnetic jacks providing an automated reflow-solder assembly solution designed to meet the uppermost customer demands.
      • VersaBlade Connector System
        Molex's VersaBlade Connector System offers superior mating reliability, easy assembly, and cost savings for white goods/HVAC applications.
      • Mini-SPOX™ Wire-to-Board Connector System
        Molex's Mini-SPOX™ 2.50 mm wire-to-board connector system provides electrical and mechanical reliability in a high-temperature design.
      • Squba Sealed Wire-to-Wire Connector
        Molex's Squba 1.80 mm-pitch sealed wire-to-wire connector system carries 6.0 A of current to deliver reliable power for space-constrained applications.
      • Compare 53553-1409
        535531008 vs 535531078 vs 535531079
      • FFC-FPC (SMT) Easy-On Connectors
        Ideal for tight-packaging applications, Molex’s line of FFC/FPC connectors come in various pitch options and include features to meet a wide variety of space and usage needs for applications in al
      Top