183-10-210-00-001000

183-10-210-00-001000
Mfr. #:
183-10-210-00-001000
Hersteller:
Mill-Max
Beschreibung:
Headers & Wire Housings 10P DIP SOLDER CUP HDR 3 LEVEL WRAPOST
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
183-10-210-00-001000 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
183-10-210-00-001000 Datasheet
ECAD Model:
Produkteigenschaft
Attributwert
Hersteller
Mill-Max Manufacturing Corp.
Produktkategorie
Rechteckige Steckverbinder – Stiftleisten, Spezialstift
Farbe
Schwarz
Serie
183
Verpackung
Schüttgut
Beendigung
Drahtwicklung
Befestigungsart
Durchgangsloch
Merkmale
-
Stecker-Typ
DIP, DIL - Kopfzeile
Kontakt-Finish
Gold
Kontakt-Finish-Dicke
10μin (0.25μm)
Anzahl der Positionen
10
Tonhöhe
0.100" (2.54mm)
Anzahl der Reihen
2
Kontaktart
Lötkelch
Zeilenabstand
0.200" (5.08mm)
Tags
183-10, 183-1, 183
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***er Electronics
Conn DIP Adapter HDR 10 POS 2.54mm Wire Wrap ST Thru-Hole Tube
***i-Key
CONN HDR DIP SOLDER 10POS GOLD
Teil # Mfg. Beschreibung Aktie Preis
183-10-210-00-001000
DISTI # 575-18310210000010
Mill-Max Mfg CorpHeaders & Wire Housings 10P DIP SOLDER CUP HDR 3 LEVEL WRAPOST
RoHS: Compliant
0
  • 123:$11.6000
  • 533:$8.5600
183-10-210-00-001000
DISTI # 000000000000402064
Mill-Max Mfg CorpConn DIP Adapter HDR 10 POS 2.54mm Wire Wrap ST Thru-Hole Tube0
  • 50:$20.7500
  • 100:$13.2200
  • 250:$8.4200
  • 500:$6.3400
183-10-210-00-001000
DISTI # MMX183-10-210-00-001000
Mill-Max Mfg Corp Asia - 0
    Bild Teil # Beschreibung
    183-10-210-00-001000

    Mfr.#: 183-10-210-00-001000

    OMO.#: OMO-183-10-210-00-001000-MILL-MAX

    Headers & Wire Housings 10P DIP SOLDER CUP HDR 3 LEVEL WRAPOST
    Verfügbarkeit
    Aktie:
    Available
    Auf Bestellung:
    4500
    Menge eingeben:
    Der aktuelle Preis von 183-10-210-00-001000 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
    Referenzpreis (USD)
    Menge
    Stückpreis
    ext. Preis
    1
    9,51 $
    9,51 $
    10
    9,03 $
    90,34 $
    100
    8,56 $
    855,90 $
    500
    8,08 $
    4 041,75 $
    1000
    7,61 $
    7 608,00 $
    Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
    Beginnen mit
    Neueste Produkte
    • Solder Cup Connectors and Terminal Pins
      Mill-Max's solder cup components simplify the task of making wired connections between PCBs or devices and PCBs.
    • 802 Series Shrouded Headers
      Mill-Max's 802 series of shrouded male pin connectors are available in 4 to 64 pin configurations and are ideal for applications with blind mate conditions.
    • Compare 183-10-210-00-001000
      1831021000001000 vs 1831030400001000 vs 1831030600001000
    • Shrouded Male Connectors
      Mill-Max's 2 mm pitch shrouded male pin connectors are available in 3 terminations styles, through-hole or surface mount options, and are RoHS-compliant.
    • Mezzanine Connectors
      Mill-Max's 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections conform to EIA-700 AAAB for IEEE 1386 applications.
    • 0861 and 0871 Spring Pins
      Mill-Max's 0861 and 0871 spring pins, designed for rugged applications, offer excellent signal integrity in shock and vibration environments.
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