OMO ElectronicOMO Electronic
Expand menu
Hallo, melde dich anMein Konto
0 Wagen

55917-1030

55917-1030
Mfr. #:
55917-1030
Hersteller:
Molex
Beschreibung:
2.0 WTB DUAL CONN DIP PLG HSG ASSY 10CKT
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
55917-1030 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Tags
55917-10, 55917-1, 55917, 5591, 559
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ex
2.00mm Pitch MicroClasp™ Wire-to-Board Header, Dual Row, Vertical, 10 Circuits, without PCB Locator
***ical
Conn Shrouded Header HDR 10 POS 2mm Solder ST Thru-Hole MicroClasp™ Tray
***et Europe
Conn Shrouded Header HDR 10 POS 2mm Solder ST Thru-Hole Tray
***umi
MicroClasp® 2.0 mm Pitch Circuit Board Wafer (55917)
***lind Electronics
Cross Referenced to MOLEX - Part MOL55917-1030
***i-Key
2.0 WTB DUAL CONN DIP PLG HSG AS
***ark
2.0 Wtb Dual Conn Dip Plg Hsg Assy 10Ckt
***ter Electronics
2.0WTB DUAL CONN DIP PLG HSG
***ell Electronics
2.0 WtB Dual Conn Dip Plg H
***nell
HEADER, VERTICAL, 2ROW, 10WAY; Connector Type:Wire-to-Board; Gender:Plug; Ways, No. of:5+5; Lead Spacing:2mm; Termination Method:Solder; Contact Material:Brass; Series:MicroClasp; Contact Plating:Lead Free Tin; No. of Rows:2; Colour:White; Contact Resistance:20mohm; Current Rating:3A; Flammability Rating:UL94V-0; Insulation Resistance:1000Mohm; Material:Glass Filled Polyester; Max Operating Temperature:+85°C; Min Temperature Operating:-25°C; No. of Contacts:10; No. of Mating Cycles:30; No. of Poles:10; Pitch:2mm; Voltage Rating, AC:250V; Voltage, Withstand:1000V; Voltage, Working:250V; De-mating Force:9.8N; Mating Force:9.8N; Max Current:3.0A; Max PCB Thickness:1.6mm; Mounting Type:Through Hole; Mounting, Orientation:Vertical; Pin Width/Dia:0.5mm
Teil # Mfg. Beschreibung Aktie Preis
0559171030
DISTI # 0559171030-ND		Molex2.0 WTB DUAL CONN DIP PLG HSG AS
RoHS: Compliant
Min Qty: 10800
Container: Tray		Temporarily Out of Stock
  • 10800:$0.6306
559171030
DISTI # 559171030		MolexConn Shrouded Header HDR 10 POS 2mm Solder ST Thru-Hole Tray (Alt: 559171030)
RoHS: Compliant
Min Qty: 10800
Container: Tray		Europe - 0
  • 108000:€0.1979
  • 54000:€0.2039
  • 32400:€0.2099
  • 21600:€0.2199
  • 10800:€0.2279
559171030
DISTI # 0559171030		MolexConn Shrouded Header HDR 10 POS 2mm Solder ST Thru-Hole Tray - Trays (Alt: 0559171030)
RoHS: Compliant
Min Qty: 10800
Container: Tray		Americas - 0
  • 108000:$0.5429
  • 54000:$0.5569
  • 32400:$0.5709
  • 21600:$0.6149
  • 10800:$0.6229
55917-1030
DISTI # 72AC7040		Molex2.0 WTB DUAL CONN DIP PLG HSG ASSY 10CKT0
  • 1000:$0.7590
  • 500:$0.8540
  • 250:$0.9340
  • 100:$1.0100
  • 50:$1.0600
  • 25:$1.1000
  • 10:$1.1400
  • 1:$1.2900
55917-1030
DISTI # 71463371		Molex2.0 WtB Dual Conn Dip Plg Hsg Assy 10Ckt
RoHS: Not Compliant		0
  • 10800:$0.7000
55917-1030
DISTI # 538-55917-1030		MolexHeaders & Wire Housings 2.0 WtB Dual Con Dip Plg Hsg Assy 10 Ckt0
  • 10800:$0.7120
55917-1030
DISTI # MOL55917-1030		MolexDUAL CONN DIP PLG HSGAmericas - 0
    0559171030
    DISTI # MOL55917-1030    		MolexCross Referenced to MOLEX - Part: MOL55917-1030DUAL CONN DIP PLG HSGAmericas - 0
      Bild Teil # Beschreibung
      55917-601LF

      Mfr.#: 55917-601LF

      OMO.#: OMO-55917-601LF

      		 USB Connectors 8P RA RECEPT RED HSG
      55917-2030

      Mfr.#: 55917-2030

      OMO.#: OMO-55917-2030-393

      		 2.0 WTB DUAL CONN DIP PLG HSG ASSY 20CKT
      55917-3814

      Mfr.#: 55917-3814

      OMO.#: OMO-55917-3814-393

      		 2.0 WTB DUAL CONN DIPPLGHSGASS
      55917-601LF

      Mfr.#: 55917-601LF

      OMO.#: OMO-55917-601LF-AMPHENOL-ICC

      		 Conn USB/Power RCP/RCP 4/4 POS Solder RA Thru-Hole 8 Terminal 2 Port
      55917-1610

      Mfr.#: 55917-1610

      OMO.#: OMO-55917-1610-410

      		 Headers & Wire Housings 16 Ckt Vert. Heade
      55917-1611

      Mfr.#: 55917-1611

      OMO.#: OMO-55917-1611-410

      		 Headers & Wire Housings 2.0 WtB Dual ConnDip PlgHsgAssy16CktBlack
      55917-1210

      Mfr.#: 55917-1210

      OMO.#: OMO-55917-1210-410

      		 Headers & Wire Housings 12 Ckt Vert. Heade
      559172210

      Mfr.#: 559172210

      OMO.#: OMO-559172210-393

      		 CONN HEADER VERT 22POS 2MM
      559170810

      Mfr.#: 559170810

      OMO.#: OMO-559170810-393

      		 CONN HEADER VERT 8POS 2MM
      55917-2838

      Mfr.#: 55917-2838

      OMO.#: OMO-55917-2838-1190

      		 2.0 WTB DUAL DIP PLG HSG ASSY2
      Verfügbarkeit
      Aktie:
      Available
      Auf Bestellung:
      5500
      Menge eingeben:
      Der aktuelle Preis von 55917-1030 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
      Referenzpreis (USD)
      Menge
      Stückpreis
      ext. Preis
      1
      0,00 $
      0,00 $
      10
      0,00 $
      0,00 $
      100
      0,00 $
      0,00 $
      500
      0,00 $
      0,00 $
      1000
      0,00 $
      0,00 $
      Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
      Beginnen mit
      Top