ZSSC3015NE1C

ZSSC3015NE1C
Mfr. #:
ZSSC3015NE1C
Hersteller:
IDT, Integrated Device Technology Inc
Beschreibung:
DICE (WAFER SAWN) - FRAME
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
ZSSC3015NE1C Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Tags
ZSSC3015NE1, ZSSC3015NE, ZSSC3015N, ZSSC3015, ZSSC301, ZSSC30, ZSSC3, ZSSC, ZSS
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***egrated Device Technology
Resistive Sensor Signal Conditioner with Diagnostics- AEC Q 100 qualified
***et
RBicdLite-Auto Sensor Signal Conditioner with Diagnostics -50 to 150°C Die Sawn on Wafer Frame
***i-Key
DICE (WAFER SAWN) - FRAME
Teil # Mfg. Beschreibung Aktie Preis
ZSSC3015NE1C
DISTI # ZSSC3015NE1C-ND
Integrated Device Technology IncDICE (WAFER SAWN) - FRAME
RoHS: Not compliant
Min Qty: 5700
Container: Tray
Temporarily Out of Stock
  • 5700:$2.6752
ZSSC3015NE1C
DISTI # ZSSC3015NE1C
Integrated Device Technology IncRBicdLite-Auto Sensor Signal Conditioner with Diagnostics -50 to 150°C Die Sawn on Wafer Frame - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ZSSC3015NE1C)
RoHS: Compliant
Min Qty: 5700
Container: Waffle Pack
Americas - 0
    ZSSC3015NE1C
    DISTI # ZSSC3015NE1C
    Integrated Device Technology IncRBicdLite-Auto Sensor Signal Conditioner with Diagnostics -50 to 150°C Die Sawn on Wafer Frame (Alt: ZSSC3015NE1C)
    RoHS: Compliant
    Min Qty: 1
    Europe - 0
    • 1000:€2.3900
    • 500:€2.5900
    • 100:€2.6900
    • 50:€2.7900
    • 25:€2.8900
    • 10:€2.9900
    • 1:€3.2900
    Bild Teil # Beschreibung
    ZSSC3026CL4WH

    Mfr.#: ZSSC3026CL4WH

    OMO.#: OMO-ZSSC3026CL4WH

    Sensor Interface Sensor Signal Conditoner
    ZSSC3036CI4R

    Mfr.#: ZSSC3036CI4R

    OMO.#: OMO-ZSSC3036CI4R

    Sensor Interface Low Pwr Hi Res 16B Sensor Signl Condtnr
    ZSSC3018KITV1P0

    Mfr.#: ZSSC3018KITV1P0

    OMO.#: OMO-ZSSC3018KITV1P0-1190

    ZSSC3018KIT EVALUATION KIT V1.0
    ZSSC3016CI1C

    Mfr.#: ZSSC3016CI1C

    OMO.#: OMO-ZSSC3016CI1C-1190

    DICE (WAFER SAWN) - FRAME
    ZSSC3016KITV1P1

    Mfr.#: ZSSC3016KITV1P1

    OMO.#: OMO-ZSSC3016KITV1P1-1190

    ZSSC3016KIT EVALUATION KIT V1.1
    ZSSC3026CC6C

    Mfr.#: ZSSC3026CC6C

    OMO.#: OMO-ZSSC3026CC6C-1190

    DICE (WAFER SAWN) - FRAME
    ZSSC3026CI6C

    Mfr.#: ZSSC3026CI6C

    OMO.#: OMO-ZSSC3026CI6C-1190

    DICE (WAFER SAWN) - FRAME
    ZSSC3027AC6B

    Mfr.#: ZSSC3027AC6B

    OMO.#: OMO-ZSSC3027AC6B-1190

    WAFER (UNSAWN) - BOX
    ZSSC3015NA2T

    Mfr.#: ZSSC3015NA2T

    OMO.#: OMO-ZSSC3015NA2T-INTEGRATED-DEVICE-TECH

    Data Converter Systems Sensor Signal Conditone
    ZSSC3026CI4RH

    Mfr.#: ZSSC3026CI4RH

    OMO.#: OMO-ZSSC3026CI4RH-1118

    Data Converter Systems Low Pwr Hi Res 16B Sensor Signl Condtn
    Verfügbarkeit
    Aktie:
    Available
    Auf Bestellung:
    5000
    Menge eingeben:
    Der aktuelle Preis von ZSSC3015NE1C dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
    Referenzpreis (USD)
    Menge
    Stückpreis
    ext. Preis
    1
    4,01 $
    4,01 $
    10
    3,81 $
    38,12 $
    100
    3,61 $
    361,15 $
    500
    3,41 $
    1 705,45 $
    1000
    3,21 $
    3 210,20 $
    Beginnen mit
    Neueste Produkte
    • IO-Link™ Devices
      Maxim Integrated’s complete portfolio of IO-link devices integrate value-adding features to provide design flexibility and offload the local processor.
    • Large Diameter Clear Hole Spacers
      RAF's large diameter clear hole spacers for industrial applications are available in standard stock sizes, various materials and finishes, and custom options.
    • WE-ExB Series Common Mode Power Line Choke
      Wurth's WE-ExB series is the double core made of MnZn and NiZn. Its insertion loss has a range of effect over a broader frequency range than does a single NiZn or MnZn core.
    • CPI2-B1-REU Production Device Programmer
      Phyton's CPI2-B1-REU in-system programmer supports Renesas microcontrollers, memory devices, and MCUs from other manufacturers.
    • CFSH05-20L Schottky Diode
      Central Semiconductor's space saving, low profile Schottky diode for applications including DC-DC conversion and circuit protection.
    Top