SIGC15T60UNX1SA1

SIGC15T60UNX1SA1
Mfr. #:
SIGC15T60UNX1SA1
Hersteller:
Infineon Technologies AG
Beschreibung:
IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T60UNX1SA1)
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
SIGC15T60UNX1SA1 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Tags
SIGC15T60, SIGC15T, SIGC15, SIGC1, SIGC, SIG
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ineon
Infineon's High Speed IGBT 2 family is a non punch-through IGBT technology with low switching losses and high robustness. | Summary of Features: Positive temperature coefficient; Easy paralleling | Target Applications: UPS; Welding
Teil # Mfg. Beschreibung Aktie Preis
SIGC15T60UNX1SA1
DISTI # SIGC15T60UNX1SA1
Infineon Technologies AGIGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T60UNX1SA1)
RoHS: Compliant
Min Qty: 270
Container: Waffle Pack
Americas - 0
  • 2700:$1.0900
  • 540:$1.1900
  • 810:$1.1900
  • 1350:$1.1900
  • 270:$1.2900
Bild Teil # Beschreibung
SIGC15T60EX1SA4

Mfr.#: SIGC15T60EX1SA4

OMO.#: OMO-SIGC15T60EX1SA4-1190

Trans IGBT Chip N-CH 600V DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T60EX1SA4)
SIGC15T60SEX1SA2

Mfr.#: SIGC15T60SEX1SA2

OMO.#: OMO-SIGC15T60SEX1SA2-1190

Trans IGBT Chip N-CH 600V DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T60SEX1SA2)
SIGC15T60UNX1SA1

Mfr.#: SIGC15T60UNX1SA1

OMO.#: OMO-SIGC15T60UNX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T60UNX1SA1)
SIGC15T65EX1SA1

Mfr.#: SIGC15T65EX1SA1

OMO.#: OMO-SIGC15T65EX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T65EX1SA1)
Verfügbarkeit
Aktie:
Available
Auf Bestellung:
1500
Menge eingeben:
Der aktuelle Preis von SIGC15T60UNX1SA1 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Referenzpreis (USD)
Menge
Stückpreis
ext. Preis
1
1,64 $
1,64 $
10
1,55 $
15,53 $
100
1,47 $
147,15 $
500
1,39 $
694,90 $
1000
1,31 $
1 308,00 $
Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
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