800-10-003-10-007000

800-10-003-10-007000
Mfr. #:
800-10-003-10-007000
Hersteller:
Mill-Max
Beschreibung:
Headers & Wire Housings SolderCup Head Single Row, T/H, 3P
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
800-10-003-10-007000 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Hersteller:
Mühle-Max
Produktkategorie:
Stiftleisten & Kabelgehäuse
RoHS:
Y
Produkt:
Überschriften
Typ:
Stiftleiste
Anzahl der Positionen:
3 Position
Tonhöhe:
2.54 mm
Anzahl der Reihen:
1 Row
Montageart:
Gerader Stift
Abschlussart:
Durchgangsloch
Montagewinkel:
Gerade
Kontakt Geschlecht:
Anstecknadel (männlich)
Kontaktbeschichtung:
Gold
Länge des Anschlusspfostens:
4.19 mm
Länge des Abschlusspfostens:
4.24 mm
Serie:
0800
Verpackung:
Schüttgut
Zubehörtyp:
-
Kontaktart:
-
Gehäusematerial:
Polyester
Spannungswert:
100 V
Marke:
Mühle-Max
Kontaktmaterial:
Messinglegierung
Zeilenabstand:
-
Gehäuse Geschlecht:
-
Isolationswiderstand:
10 GOhms
Produktart:
Stiftleisten & Kabelgehäuse
Werkspackungsmenge:
68
Unterkategorie:
Stiftleisten & Kabelgehäuse
Tags
800-10-003-1, 800-10-003, 800-10-00, 800-10-0, 800-10, 800-1, 800
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ied Electronics & Automation
STANDARD SOCKET HEADER; 03 Pins; Gold over Nickel
***er Electronics
Headers & Wire Housings SolderCup Head Single Row, T/H, 3P
***i-Key
CONN HDR STRIP SOLDER 3POS GOLD
Bild Teil # Beschreibung
IZNR1S42N

Mfr.#: IZNR1S42N

OMO.#: OMO-IZNR1S42N

Pushbutton Switches OFF - ON 200A 48V PlungerRoundCurved
RG2012P-8872-B-T5

Mfr.#: RG2012P-8872-B-T5

OMO.#: OMO-RG2012P-8872-B-T5

Thin Film Resistors - SMD 1/8W 88.7K Ohm 0.1% 0805 25ppm
IZNR1S42N

Mfr.#: IZNR1S42N

OMO.#: OMO-IZNR1S42N-APEM

Pushbutton Switches OFF - ON 200A 48V PlungerRoundCurved
RG2012P-8872-B-T5

Mfr.#: RG2012P-8872-B-T5

OMO.#: OMO-RG2012P-8872-B-T5-SUSUMU

Thin Film Resistors - SMD 1/8W Regular 88.7K ohm 0.1% 25ppm
0376-0-43-80-07-27-10-0

Mfr.#: 0376-0-43-80-07-27-10-0

OMO.#: OMO-0376-0-43-80-07-27-10-0-1190

Circuit Board Hardware - PCB OFP SLDR MT RECPT #7 CNTCT .065-.082
Verfügbarkeit
Aktie:
47
Auf Bestellung:
2030
Menge eingeben:
Der aktuelle Preis von 800-10-003-10-007000 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Beginnen mit
Neueste Produkte
  • Straight and Right Angle Male PCB Pins
    Mill-Max's straight and right angle pins are precision-machined to assure consistent bends each time and offer full radius shaped tips to simplify fabrication.
  • Super Low-Profile Sockets
    Mill-Max's super low-profile sockets are ideal for board stacking and wire to board applications where minimizing package height is paramount.
  • Compare 800-10-003-10-007000
    8001000310001000 vs 8001000310002000 vs 8001000310004000
  • Solder Cup Connectors and Terminal Pins
    Mill-Max's solder cup components simplify the task of making wired connections between PCBs or devices and PCBs.
  • Zero-Profile Dual-Entry Receptacle
    Mill-Max's zero-profile solderless press-fit receptacle has a .045” minimum mating pin length for bottom entry and .054” minimum length for top-entry insertion.
  • 0861 and 0871 Spring Pins
    Mill-Max's 0861 and 0871 spring pins, designed for rugged applications, offer excellent signal integrity in shock and vibration environments.
Top