| Mfr. #: | XC7Z045-1FBG676CES |
|---|---|
| Hersteller: | Xilinx |
| Beschreibung: | IC SOC CORTEX-A9 KINTEX7 676FBGA |
| Lebenszyklus: | Neu von diesem Hersteller. |
| Datenblatt: | XC7Z045-1FBG676CES Datenblatt |
Product belongs to the ZynqR-7000 series. Tray is the packaging method for this product 676-BBGA, FCBGA Operational temperature range: 0°C ~ 85°C (TJ) Supplier device package: 676-FCBGA (27x27) Operating frequency: 667MHz The architecture of this product is MCU, FPGA . 256KB of MCU-RAM CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interface Primary-Attributes: Kintex-7 FPGA, 350K Logic Cells
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XC7Z045-1FBG676CES Specifications
A: What is the Series of the product?
Q: The Series of the product is ZynqR-7000.
A: What is the Packaging of the product?
Q: The Packaging of the product is Tray.
A: At what frequency does the Package-Case?
Q: The product Package-Case is 676-BBGA, FCBGA.
A: Is the cutoff frequency of the product Operating-Temperature?
Q: Yes, the product's Operating-Temperature is indeed 0°C ~ 85°C (TJ)
A: At what frequency does the Supplier-Device-Package?
Q: The product Supplier-Device-Package is 676-FCBGA (27x27).
A: At what frequency does the Speed?
Q: The product Speed is 667MHz.
A: At what frequency does the Architecture?
Q: The product Architecture is MCU, FPGA.
A: Is the cutoff frequency of the product MCU-RAM?
Q: Yes, the product's MCU-RAM is indeed 256KB
A: At what frequency does the Connectivity?
Q: The product Connectivity is CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG.
A: What is the Primary-Attributes of the product?
Q: The Primary-Attributes of the product is Kintex-7 FPGA, 350K Logic Cells.