| Mfr. #: | XC7Z100-1FFG900I |
|---|---|
| Hersteller: | Xilinx |
| Beschreibung: | IC SOC CORTEX-A9 KINTEX7 900FBGA |
| Lebenszyklus: | Neu von diesem Hersteller. |
| Datenblatt: | XC7Z100-1FFG900I Datenblatt |
Product belongs to the ZynqR-7000 series. Tray is the packaging method for this product 900-BBGA, FCBGA Operational temperature range: -40°C ~ 100°C (TJ) Supplier device package: 900-FCBGA (31x31) Operating frequency: 667MHz The architecture of this product is MCU, FPGA . 256KB of MCU-RAM CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG interface Primary-Attributes: Kintex-7 FPGA, 444K Logic Cells
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
XC7Z100-1FFG900I Specifications
A: Is the cutoff frequency of the product Series?
Q: Yes, the product's Series is indeed ZynqR-7000
A: What is the Packaging of the product?
Q: The Packaging of the product is Tray.
A: At what frequency does the Package-Case?
Q: The product Package-Case is 900-BBGA, FCBGA.
A: At what frequency does the Operating-Temperature?
Q: The product Operating-Temperature is -40°C ~ 100°C (TJ).
A: What is the Supplier-Device-Package of the product?
Q: The Supplier-Device-Package of the product is 900-FCBGA (31x31).
A: Is the cutoff frequency of the product Speed?
Q: Yes, the product's Speed is indeed 667MHz
A: At what frequency does the Architecture?
Q: The product Architecture is MCU, FPGA.
A: What is the MCU-RAM of the product?
Q: The MCU-RAM of the product is 256KB.
A: What is the Connectivity of the product?
Q: The Connectivity of the product is CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG.
A: At what frequency does the Primary-Attributes?
Q: The product Primary-Attributes is Kintex-7 FPGA, 444K Logic Cells.