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PM8633A1-F3EI

PM8633A1-F3EI
Mfr. #:
PM8633A1-F3EI
Hersteller:
Microchip / Microsemi
Beschreibung:
Interface - Specialized NVMe2108LC, w/ thinner z height
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
PM8633A1-F3EI Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Mehr Informationen:
PM8633A1-F3EI Mehr Informationen
Produkteigenschaft
Attributwert
Hersteller:
Maxim Integrated
Produktkategorie:
Schnittstelle - Spezialisiert
RoHS:
Y
Typ:
Sensorschnittstelle
Betriebsversorgungsspannung:
7 V to 65 V
Betriebsversorgungsstrom:
600 uA
Minimale Betriebstemperatur:
- 40 C
Maximale Betriebstemperatur:
+ 125 C
Montageart:
SMD/SMT
Paket / Koffer:
TQFN-32
Verpackung:
Spule
Serie:
MAX22195
Marke:
Maxim Integrated
Oberflächentyp:
Parallel
Pd - Verlustleistung:
2222 mW
Produktart:
Schnittstelle - Spezialisiert
Werkspackungsmenge:
2500
Unterkategorie:
Schnittstellen-ICs
Versorgungsspannung - Max.:
65 V
Versorgungsspannung - Min.:
3 V
Tags
PM863, PM86, PM8
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ark
Afm-700 Supercap Kit, 623 Fbga 17X17X1.72Mm Tray Rohs Compliant: Yes
***et
NVME2108LC, W/ THINNER Z HEIGHT
Connected (Wired & Wireless)
Microchip Technology Connectivity is easy to add into applications, as Microchip's MCUs and MPUs are designed to be compatible with Microchip wired and wireless devices. Robust, reliable, high-speed connectivity is available with a broad portfolio of wired connectivity solutions. Mobility, convenience, and enhanced user experience, is possible with a wide range of wireless connectivity solutions. And, with pre-certified modules, designers can avoid worrying about communication regulations.
Wired Connectivity
Microchip Technology Wired Connectivity Solutions, based on the IEEE Ethernet standards, enable robust, reliable, high-speed connectivity and control when added to embedded designs. Ethernet enables systems to be monitored securely over the Internet, allows for precision control of industrial motors at production facilities, and enables new IoT products with common MCU interfaces like PCI/PCIe®, SPI, USB and 8-/16-bit parallel bus. Microchip Ethernet solutions include highly integrated Ethernet PHYs, bridges, controllers, and switches complemented by a full line of PIC32 MCUs and SAM Arm® Cortex®-based MCUs and MPUs.
Teil # Mfg. Beschreibung Aktie Preis
PM8633A1-F3EI
DISTI # PM8633A1-F3EI-ND		Microsemi CorporationNVME2108LC, W/ THINNER Z HEIGHT
RoHS: Compliant
Min Qty: 90
Container: Tray		Temporarily Out of Stock
  • 90:$85.8000
PM8633A1-F3EI
DISTI # 494-PM8633A1-F3EI		Microsemi CorporationInterface - Specialized
RoHS: Compliant		0
  • 90:$85.8100
Bild Teil # Beschreibung
PM8633A1-F3EI

Mfr.#: PM8633A1-F3EI

OMO.#: OMO-PM8633A1-F3EI

 Interface - Specialized NVMe2108LC, w/ thinner z height
PM8633A1-F3EI

Mfr.#: PM8633A1-F3EI

OMO.#: OMO-PM8633A1-F3EI-1190

 NVME2108LC, W/ THINNER Z HEIGHT
Verfügbarkeit
Aktie:
Available
Auf Bestellung:
4500
Menge eingeben:
Der aktuelle Preis von PM8633A1-F3EI dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Referenzpreis (USD)
Menge
Stückpreis
ext. Preis
90
85,81 $
7 722,90 $
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