210-47-316-41-001000

210-47-316-41-001000
Mfr. #:
210-47-316-41-001000
Hersteller:
Mill-Max
Beschreibung:
IC & Component Sockets STANDRD SOLDER TAIL DIP SOCKET
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
210-47-316-41-001000 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
210-47-316-41-001000 Datasheet
ECAD Model:
Produkteigenschaft
Attributwert
Hersteller:
Mühle-Max
Produktkategorie:
IC- und Komponentensockel
Produkt:
DIP / SIP-Buchsen
Anzahl der Positionen:
16 Position
Anzahl der Reihen:
2 Row
Typ:
Steckdose
Tonhöhe:
2.54 mm
Abschlussart:
Durchgangsloch
Kontaktbeschichtung:
Gold
Zeilenabstand:
7.62 mm
Aktuelle Bewertung:
3 A
Gehäusematerial:
Polyester (PCT)
Marke:
Mühle-Max
Kontaktmaterial:
Berylliumkupfer
Brennbarkeitsbewertung:
UL 94 V-0
Montageart:
Gerader Stift
Maximale Betriebstemperatur:
+ 125 C
Minimale Betriebstemperatur:
- 55 C
Produktart:
IC- und Komponentensockel
Werkspackungsmenge:
25
Unterkategorie:
IC- und Komponentensockel
Tags
210-47, 210-4, 210
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ied Electronics & Automation
STANDRD SOLDER TAIL SIP SOCKET; 16 Pins; Tin over Nickel
***er Electronics
STANDRD SOLDER TAIL DIP SOCKET
***i-Key
CONN IC DIP SOCKET 16POS GOLD
Bild Teil # Beschreibung
LM393P

Mfr.#: LM393P

OMO.#: OMO-LM393P

Analog Comparators Dual Differential
MAX809SEUR+T

Mfr.#: MAX809SEUR+T

OMO.#: OMO-MAX809SEUR-T

Supervisory Circuits 3-Pin MPU Supervisor
FDV301N

Mfr.#: FDV301N

OMO.#: OMO-FDV301N

MOSFET N-Ch Digital
CD40106BE

Mfr.#: CD40106BE

OMO.#: OMO-CD40106BE

Inverters Hex Schmitt Trigger
UA723CN

Mfr.#: UA723CN

OMO.#: OMO-UA723CN

Linear Voltage Regulators Adjustable Prec V
210-47-314-41-001000

Mfr.#: 210-47-314-41-001000

OMO.#: OMO-210-47-314-41-001000

IC & Component Sockets STANDRD SOLDER TAIL DIP SOCKET
CD4051BE

Mfr.#: CD4051BE

OMO.#: OMO-CD4051BE

Multiplexer Switch ICs 8-Channel Analog
FH41-40S-0.5SH

Mfr.#: FH41-40S-0.5SH

OMO.#: OMO-FH41-40S-0-5SH-HIROSE

FFC & FPC Connectors 40P SMT HORIZ ZIF 2.5MM HT .5MM PITCH
LM393P

Mfr.#: LM393P

OMO.#: OMO-LM393P-TEXAS-INSTRUMENTS

Analog Comparators Dual Differential
CD40106BE

Mfr.#: CD40106BE

OMO.#: OMO-CD40106BE-TEXAS-INSTRUMENTS

Neu und Original
Verfügbarkeit
Aktie:
87
Auf Bestellung:
2070
Menge eingeben:
Der aktuelle Preis von 210-47-316-41-001000 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Beginnen mit
Neueste Produkte
  • Straight and Right Angle Male PCB Pins
    Mill-Max's straight and right angle pins are precision-machined to assure consistent bends each time and offer full radius shaped tips to simplify fabrication.
  • Super Low-Profile Sockets
    Mill-Max's super low-profile sockets are ideal for board stacking and wire to board applications where minimizing package height is paramount.
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  • Solder Cup Connectors and Terminal Pins
    Mill-Max's solder cup components simplify the task of making wired connections between PCBs or devices and PCBs.
  • Zero-Profile Dual-Entry Receptacle
    Mill-Max's zero-profile solderless press-fit receptacle has a .045” minimum mating pin length for bottom entry and .054” minimum length for top-entry insertion.
  • 0861 and 0871 Spring Pins
    Mill-Max's 0861 and 0871 spring pins, designed for rugged applications, offer excellent signal integrity in shock and vibration environments.
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