HSS-B20-0508H-01

HSS-B20-0508H-01
Mfr. #:
HSS-B20-0508H-01
Hersteller:
CUI Inc
Beschreibung:
Heat Sinks 42.5 x 24.2 x 25.4mm TO-220 bolt on/pin
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
HSS-B20-0508H-01 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
HSS-B20-0508H-01 Datasheet
ECAD Model:
Produkteigenschaft
Attributwert
Hersteller:
CUI Inc.
Produktkategorie:
Temperatur fällt
Produkt:
Temperatur fällt
Montageart:
PCB
Kühlkörpermaterial:
Aluminium
Thermischer Widerstand:
12.99 C/W
Länge:
25.4 mm
Breite:
25.4 mm
Höhe:
42.5 mm
Designed für:
TO-220
Verpackung:
Tablett
Typ:
Gestanzter Kühlkörper
Marke:
CUI
Höhe in:
-
Höhe - mm:
-
Länge - Zoll:
-
Länge - mm:
-
Produktart:
Temperatur fällt
Werkspackungsmenge:
60
Unterkategorie:
Temperatur fällt
Breite - Zoll:
-
Breite - mm:
-
Tags
HSS-B20-0508, HSS-B20-050, HSS-B20-05, HSS-B20-0, HSS-B, HSS
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
*** Devices
Stamped Heat Sink, TO-220, Aluminum, PCB, 5.08 mm Horizontal Solder Pin
***i-Key
HEATSINK TO-220 7.4W ALUMINUM
Bild Teil # Beschreibung
HSS-B20-NP-14

Mfr.#: HSS-B20-NP-14

OMO.#: OMO-HSS-B20-NP-14

Heat Sinks 25.4 x 25 x 8.5mm TO-220 clip
HSS-B20-0508H-01S

Mfr.#: HSS-B20-0508H-01S

OMO.#: OMO-HSS-B20-0508H-01S

Heat Sinks 29.97 x 25.4 x12.7mm TO-220 bolt on/pin
HSS-B20-NP-04

Mfr.#: HSS-B20-NP-04

OMO.#: OMO-HSS-B20-NP-04

Heat Sinks 36.83 x 44.5 x 9.4mm TO-220 bolt on
HSS-B20-NP-10

Mfr.#: HSS-B20-NP-10

OMO.#: OMO-HSS-B20-NP-10

Heat Sinks 19 x 12.8 x 12.7mm TO-220 clip
HSS-B20-085H

Mfr.#: HSS-B20-085H

OMO.#: OMO-HSS-B20-085H

Heat Sinks 20 x 19.7 x 8.1mm TO-220 solder pins
HSS-B20-0635H

Mfr.#: HSS-B20-0635H

OMO.#: OMO-HSS-B20-0635H

Heat Sinks 19.05 x 13.21x6.35mm TO-220 solder pin
HSS-B20-061H-03

Mfr.#: HSS-B20-061H-03

OMO.#: OMO-HSS-B20-061H-03

Heat Sinks 19 x 13 x 12.7mm TO-220 solder pin
HSS-B20-0503H

Mfr.#: HSS-B20-0503H

OMO.#: OMO-HSS-B20-0503H-CUI

HEATSINK TO-220 4.6W ALUMINUM
HSS-B20-0635H-02

Mfr.#: HSS-B20-0635H-02

OMO.#: OMO-HSS-B20-0635H-02-CUI

HEATSINK TO-220 2.6W ALUMINUM
HSS-B20-NPR-02

Mfr.#: HSS-B20-NPR-02

OMO.#: OMO-HSS-B20-NPR-02-CUI

HEATSINK TO-220 5.1W ALUMINUM
Verfügbarkeit
Aktie:
Available
Auf Bestellung:
2000
Menge eingeben:
Der aktuelle Preis von HSS-B20-0508H-01 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Beginnen mit
Neueste Produkte
  • Low Power Board Mount AC-DC Power Supplies
    Available in encapsulated and open-frame packages, CUI’s PSK, PBO, and VOF series of low-power, board-mount AC-DC power supplies range from 1 to 25 W and offer a variety of configurations.
  • Compare HSS-B20-0508H-01
    HSSB200508H01 vs HSSB200508H01R vs HSSB200508H01S
  • IP-Rated USB Connectors
    CUI's waterproof USB receptacle connectors are IP-rated to deal with harsh conditions found in industrial and outdoor applications.
  • IP Rated DC Power Jacks
    CUI’s waterproof DC power jack connectors carry ratings of IP67 to deal with the harsh conditions found in industrial and outdoor applications.
  • Screwless Terminal Blocks
    CUI's screwless terminal block connectors come in blue and gray options with horizontal and 45-degree orientations for a wide range of interconnect needs.
  • CDM Series Low Profile Speakers
    CUI's speakers are ideal for applications requiring a low profile design in the consumer electronics and mobile equipment space.
Top