SIDC38D65C8X1SA1

SIDC38D65C8X1SA1
Mfr. #:
SIDC38D65C8X1SA1
Hersteller:
Infineon Technologies AG
Beschreibung:
Fast switching diode chip in EMCON 3 -Technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D65C8X1SA1)
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
SIDC38D65C8X1SA1 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Produkteigenschaft
Attributwert
Tags
SIDC38D65, SIDC38, SIDC3, SIDC, SID
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
Fast switching diode chip in EMCON 3 -Technology
***ineon
Emitter Controlled Diode is Infineon's unique Fast Recovery Diode technology. The ultrathin wafer and Fieldstop technology makes the Emitter Controlled Diode ideally suited for consumer and industry applications as it lowers the turn-on losses of the IGBT with soft recovery. The Emitter Controlled Diode is optimized for Infineon IGBT technology. | Summary of Features: Soft, fast switching; Low reverse recovery charge; Small temperature coefficient | Target Applications: Industrial drives; Resonant applications
Teil # Mfg. Beschreibung Aktie Preis
SIDC38D65C8X1SA1
DISTI # SIDC38D65C8X1SA1
Infineon Technologies AGFast switching diode chip in EMCON 3 -Technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D65C8X1SA1)
RoHS: Compliant
Min Qty: 101
Container: Waffle Pack
Americas - 0
  • 1010:$3.0900
  • 505:$3.1900
  • 303:$3.2900
  • 202:$3.3900
  • 101:$3.4900
SIDC38D65C8X1SA1
DISTI # SP000691620
Infineon Technologies AGFast switching diode chip in EMCON 3 -Technology (Alt: SP000691620)
RoHS: Compliant
Min Qty: 1
Europe - 0
  • 1000:€2.4900
  • 500:€2.6900
  • 100:€2.7900
  • 50:€2.8900
  • 25:€3.0900
  • 10:€3.1900
  • 1:€3.4900
Bild Teil # Beschreibung
SIDC38D60C8X1SA1

Mfr.#: SIDC38D60C8X1SA1

OMO.#: OMO-SIDC38D60C8X1SA1-1190

DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D60C8X1SA1)
SIDC38D65C8AX7SA1

Mfr.#: SIDC38D65C8AX7SA1

OMO.#: OMO-SIDC38D65C8AX7SA1-1190

Neu und Original
SIDC38D65C8X1SA1

Mfr.#: SIDC38D65C8X1SA1

OMO.#: OMO-SIDC38D65C8X1SA1-1190

Fast switching diode chip in EMCON 3 -Technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D65C8X1SA1)
SIDC38D65C8X1SA1INFINEON

Mfr.#: SIDC38D65C8X1SA1INFINEON

OMO.#: OMO-SIDC38D65C8X1SA1INFINEON-1190

Neu und Original
SIDC38D60C6X1SA3

Mfr.#: SIDC38D60C6X1SA3

OMO.#: OMO-SIDC38D60C6X1SA3-INFINEON-TECHNOLOGIES

DIODE GEN PURP 600V 150A WAFER
Verfügbarkeit
Aktie:
Available
Auf Bestellung:
3000
Menge eingeben:
Der aktuelle Preis von SIDC38D65C8X1SA1 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
Referenzpreis (USD)
Menge
Stückpreis
ext. Preis
1
0,00 $
0,00 $
10
0,00 $
0,00 $
100
0,00 $
0,00 $
500
0,00 $
0,00 $
1000
0,00 $
0,00 $
Aufgrund von Halbleiterknappheit ab 2021 ist der untere Preis der Normalpreis vor 2021. Bitte senden Sie eine Anfrage zur Bestätigung.
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