PartNumber | 10-3503-30 | 10-3503-20 | 10-3503-21 |
Description | IC & Component Sockets 10P COLLET SOCKET .300" WIRE WRAP | IC & Component Sockets 10P .300 WIRE WRAP | CONN IC DIP SOCKET 10POS GOLD |
Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
Product Category | IC & Component Sockets | IC & Component Sockets | Sockets for ICs, Transistors |
RoHS | Y | Y | - |
Series | 513 | 513 | 503 |
Brand | Aries Electronics | Aries Electronics | - |
Product Type | IC & Component Sockets | IC & Component Sockets | - |
Factory Pack Quantity | 1 | 1 | - |
Subcategory | IC & Component Sockets | IC & Component Sockets | - |
Product | - | DIP / SIP Sockets | - |
Number of Positions | - | 10 Position | - |
Termination Style | - | Solder Pin | - |
Contact Plating | - | Gold | - |
Mounting Style | - | PCB | - |
Maximum Operating Temperature | - | + 125 C | - |
Minimum Operating Temperature | - | - 55 C | - |
Type | - | - | DIP, 0.3" (7.62mm) Row Spacing |
Packaging | - | - | Bulk |
Termination | - | - | Wire Wrap |
Operating Temperature | - | - | -55°C ~ 125°C |
Mounting Type | - | - | Through Hole |
Features | - | - | Closed Frame |
Housing Material | - | - | Polyamide (PA46), Nylon 4/6, Glass Filled |
Number of Positions or Pins Grid | - | - | 10 (2 x 5) |
Pitch Mating | - | - | 0.100" (2.54mm) |
Contact Finish Mating | - | - | Gold |
Pitch Post | - | - | 0.100" (2.54mm) |
Contact Finish Post | - | - | Gold |
Contact Finish Thickness Mating | - | - | 10μin (0.25μm) |
Contact Material Mating | - | - | Beryllium Copper |
Contact Finish Thickness Post | - | - | 10μin (0.25μm) |
Contact Material Post | - | - | Phosphor Bronze |