PartNumber | 1109681-328 | 1109681-324 | 1109681-320 |
Description | IC & Component Sockets MIRROR IMAGE COLLET 28 PINS | IC & Component Sockets MIRROR IMAGE COLLET 24 PINS | IC & Component Sockets MIRROR IMAGE COLLET 20 PINS |
Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
Product Category | Sockets for ICs, Transistors | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
Series | - | - | - |
Type | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing |
Packaging | Bulk | Bulk | Bulk |
Termination | Solder | Solder | Solder |
Operating Temperature | - | - | - |
Mounting Type | Through Hole | Through Hole | Through Hole |
Features | Spacer | Spacer | Spacer |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyamide (PA46), Nylon 4/6, Glass Filled |
Number of Positions or Pins Grid | 28 (2 x 14) | 24 (2 x 12) | 20 (2 x 10) |
Pitch Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
Contact Finish Mating | Gold | Gold | Gold |
Pitch Post | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
Contact Finish Post | Tin-Lead | Tin-Lead | Tin-Lead |
Contact Finish Thickness Mating | 10μin (0.25μm) | 10μin (0.25μm) | 10μin (0.25μm) |
Contact Material Mating | Brass | Brass | Brass |
Contact Finish Thickness Post | 200μin (5.08μm) | 200μin (5.08μm) | 200μin (5.08μm) |
Contact Material Post | Brass | Brass | Brass |