169-PGM13001-51 vs 169-PLS17012-12 vs 169-PLS13001-16

 
PartNumber169-PGM13001-51169-PLS17012-12169-PLS13001-16
DescriptionIC & Component Sockets PIN GRID ARRAY SOLDER TAIL 169 PINSIC & Component SocketsIC & Component Sockets 169 PIN PGA NICKEL
ManufacturerAries ElectronicsAries ElectronicsAries Electronics
Product CategoryIC & Component SocketsIC & Component SocketsSockets for ICs, Transistors
RoHSN--
ProductPGA SocketsPGA Sockets-
Termination StyleSolder TailSolder Tail-
SeriesPGM-PLS
BrandAries ElectronicsAries Electronics-
Product TypeIC & Component SocketsIC & Component Sockets-
Factory Pack Quantity11-
SubcategoryIC & Component SocketsIC & Component Sockets-
Number of Positions-169 Position-
Type-Handle On Left PGA, ZIF, Test and Burn-In SocketPGA, ZIF (ZIP)
Pitch-2.54 mm-
Contact Plating-Gold-
Current Rating-1 A-
Housing Material-Polyphenylene Sulfide (PPS)Polyphenylene Sulfide (PPS)
Contact Material-Beryllium Copper-
Flammability Rating-UL 94 V-0-
Lead Length-3.17 mm-
Mounting Style-Through Hole-
Maximum Operating Temperature-+ 125 C-
Minimum Operating Temperature-- 65 C-
Packaging--Bulk
Termination--Solder
Operating Temperature---65°C ~ 200°C
Mounting Type--Through Hole
Features--Closed Frame
Number of Positions or Pins Grid---
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Nickel Bronze
Contact Finish Thickness Mating--30μin (0.76μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--50μin (1.27μm)
Contact Material Post--Beryllium Copper
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