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| PartNumber | 24-6574-10 | 24-6574-16 | 24-6574-11 |
| Description | IC & Component Sockets QUICK RELEASE 24 PIN TIN | IC & Component Sockets QUICK RELEASE 24 PIN NICKEL | IC & Component Sockets QUICK RELEASE 24 PIN GOLD |
| Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
| Product Category | IC & Component Sockets | IC & Component Sockets | Sockets for ICs, Transistors |
| RoHS | Y | Y | - |
| Product | Zero Insertion Force (ZIF) Sockets | Zero Insertion Force (ZIF) Sockets | - |
| Number of Positions | 24 Position | 24 Position | - |
| Contact Plating | Tin | Nickel Boron | - |
| Series | X57X | X57X | 57 |
| Brand | Aries Electronics | Aries Electronics | - |
| Mounting Style | PCB | PCB | - |
| Product Type | IC & Component Sockets | IC & Component Sockets | - |
| Factory Pack Quantity | 12 | 12 | - |
| Subcategory | IC & Component Sockets | IC & Component Sockets | - |
| Unit Weight | 0.070548 oz | - | - |
| Type | - | - | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Packaging | - | - | Bulk |
| Termination | - | - | Solder |
| Operating Temperature | - | - | - |
| Mounting Type | - | - | Through Hole |
| Features | - | - | Closed Frame |
| Housing Material | - | - | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins Grid | - | - | 24 (2 x 12) |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Tin |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Tin |
| Contact Finish Thickness Mating | - | - | 200μin (5.08μm) |
| Contact Material Mating | - | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | 200μin (5.08μm) |
| Contact Material Post | - | - | Beryllium Copper |