28-C182-10 vs 28-C182-00 vs 28-C182-11

 
PartNumber28-C182-1028-C182-0028-C182-11
DescriptionIC & Component Sockets 28P LOCK/EJECT SOCKIC & Component Sockets LOCK/EJECT DIP SCKT SURFACE MOUNT 28 PINIC & Component Sockets 28P LOCK/EJECT SKT
ManufacturerAries ElectronicsAries Electronics-
Product CategoryIC & Component SocketsSockets for ICs, Transistors-
RoHSY--
ProductDIP / SIP Sockets--
Number of Positions28 Position--
Number of Rows2 Row--
Pitch2.54 mm--
Termination StyleSolder Tail--
Contact PlatingGold--
Row Spacing15.24 mm--
SeriesEJECT-A-CHIPEJECT-A-DIP-
Current Rating3 A--
FeaturesLock/eject DIP collet socketClosed Frame-
Housing MaterialPolyphenylene Sulfide (PPS)Polyamide (PA46), Nylon 4/6, Glass Filled-
Voltage Rating1 kV--
BrandAries Electronics--
Case StyleDIP--
Contact MaterialBrass Alloy--
Flammability RatingUL 94 V-0--
Mounting StyleThrough Hole--
Maximum Operating Temperature+ 125 C--
Minimum Operating Temperature- 55 C--
Product TypeIC & Component Sockets--
Factory Pack Quantity1--
SubcategoryIC & Component Sockets--
Unit Weight0.211644 oz--
Type-DIP, 0.6" (15.24mm) Row Spacing-
Packaging-Bulk-
Termination-Solder-
Operating Temperature--55°C ~ 105°C-
Mounting Type-Surface Mount-
Number of Positions or Pins Grid-28 (2 x 14)-
Pitch Mating-0.100" (2.54mm)-
Contact Finish Mating-Gold-
Pitch Post-0.100" (2.54mm)-
Contact Finish Post-Tin-
Contact Finish Thickness Mating-10μin (0.25μm)-
Contact Material Mating-Beryllium Copper-
Contact Finish Thickness Post-200μin (5.08μm)-
Contact Material Post-Brass-
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