PartNumber | 36-6553-16 | 36-6553-11 | 36-6553-10 |
Description | IC & Component Sockets DIP TEST SCKT NICKEL 36 PINS | IC & Component Sockets DIP TEST SCKT GOLD 36 PINS | IC & Component Sockets DIP TEST SCKT TIN 36 PINS |
Manufacturer | - | Aries Electronics | Aries Electronics |
Product Category | - | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
Series | - | 55 | 55 |
Type | - | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
Packaging | - | Bulk | Bulk |
Termination | - | Solder | Solder |
Operating Temperature | - | - | - |
Mounting Type | - | Through Hole | Through Hole |
Features | - | Closed Frame | Closed Frame |
Housing Material | - | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled |
Number of Positions or Pins Grid | - | 36 (2 x 18) | 36 (2 x 18) |
Pitch Mating | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
Contact Finish Mating | - | Nickel Boron | Gold |
Pitch Post | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
Contact Finish Post | - | Nickel Boron | Gold |
Contact Finish Thickness Mating | - | 50μin (1.27μm) | - |
Contact Material Mating | - | Beryllium Copper | Beryllium Copper |
Contact Finish Thickness Post | - | 50μin (1.27μm) | - |
Contact Material Post | - | Beryllium Copper | Beryllium Copper |