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40-6554-11 vs 40-6554-16 vs 40-6554-10

 
PartNumber40-6554-1140-6554-1640-6554-10
DescriptionIC & Component Sockets 40 PIN W/HANDLE 1IC & Component Sockets 40P ZIF NKL PLTDIC & Component Sockets 40P TEST SOCKET TIN
ManufacturerAries ElectronicsAries ElectronicsAries Electronics
Product CategoryIC & Component SocketsIC & Component SocketsSockets for ICs, Transistors
RoHSYT-
ProductZero Insertion Force (ZIF) Sockets--
Number of Positions40 Position--
Number of Rows2 Row2 Row-
TypeClosed Frame-DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Pitch2.54 mm2.54 mm-
Termination StyleSolder TailSolder Pin-
Contact PlatingGoldNickel Boron-
Row Spacing15.24 mm--
SeriesX55XX55X55
Current Rating1 A--
FeaturesUniversal ZIF DIP-Closed Frame
Housing MaterialPolyphenylene Sulfide (PPS)-Polyphenylene Sulfide (PPS), Glass Filled
Voltage Rating1 kVAC--
BrandAries ElectronicsAries Electronics-
Case StyleDIP--
Contact MaterialBeryllium Copper--
Flammability RatingUL 94 V-0--
Mounting StyleThrough HoleThrough Hole-
Maximum Operating Temperature+ 150 C--
Minimum Operating Temperature- 55 C--
Product TypeIC & Component SocketsIC & Component Sockets-
Factory Pack Quantity77-
SubcategoryIC & Component SocketsIC & Component Sockets-
Unit Weight1.279986 oz--
Packaging--Bulk
Termination--Solder
Operating Temperature---
Mounting Type--Through Hole
Number of Positions or Pins Grid--40 (2 x 20)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Tin
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Tin
Contact Finish Thickness Mating--200μin (5.08μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--200μin (5.08μm)
Contact Material Post--Beryllium Copper
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