4309R-101-622LF vs 4309R-101-680 vs 4309R-101-622

 
PartNumber4309R-101-622LF4309R-101-6804309R-101-622
DescriptionResistor Networks & Arrays THK FILM MOLD SIP 6.2K 2%Resistor Networks & Arrays 10pin 68ohms Bussed Low ProfileResistor Networks & Arrays RNET - THK FILM MOLD SIP
ManufacturerBournsBourns Inc.Bourns Inc.
Product CategoryResistor Networks & ArraysResistor Networks, ArraysResistor Networks, Arrays
RoHSE--
Series4300R4300R4300R
ProductNetworks--
Termination StyleSIP--
Circuit TypeBussedBussedBussed
Number of Resistors888
Number of Pins999
Minimum Operating Temperature- 55 C--
Maximum Operating Temperature+ 125 C--
Package / CaseSIP-9--
Length22.45 mm--
Width2.16 mm--
Height4.95 mm0.195" (4.95mm)0.195" (4.95mm)
PackagingBulkBulkBulk
Operating Temperature Range- 55 C to + 125 C--
BrandBourns--
Lead Spacing2.54 mm--
Power per Element0.2 W (1/5 W)--
Power Total Package1.13 W--
Product TypeResistor Networks & Arrays--
Factory Pack Quantity22--
SubcategoryResistors--
Unit Weight0.035274 oz--
Operating Temperature--55°C ~ 125°C-55°C ~ 125°C
Mounting Type-Through HoleThrough Hole
Size Dimension-0.884" L x 0.085" W (22.45mm x 2.16mm)0.884" L x 0.085" W (22.45mm x 2.16mm)
Applications---
Supplier Device Package-9-SIP9-SIP
Tolerance-±2%±2%
Temperature Coefficient-±100ppm/°C±100ppm/°C
Resistance Ohms-68
Power Per Element-200mW200mW
Package Case-9-SIP9-SIP
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