 | | | |
| PartNumber | 514-83-352M26-001148 | 514-83-356M26-001148 | 514-83-357M19-001148 |
| Description | CONN SOCKET BGA 352POS GOLD | CONN SOCKET BGA 356POS GOLD | CONN SOCKET BGA 357POS GOLD |
| Manufacturer | - | - | Preci-Dip |
| Product Category | - | - | Sockets for ICs, Transistors |
| Series | - | - | 514 |
| Type | - | - | BGA |
| Packaging | - | - | Bulk |
| Termination | - | - | Solder |
| Operating Temperature | - | - | -55°C ~ 125°C |
| Mounting Type | - | - | Surface Mount |
| Features | - | - | Open Frame |
| Housing Material | - | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Number of Positions or Pins Grid | - | - | 357 (19 x 19) |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Gold |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Tin |
| Contact Finish Thickness Mating | - | - | 29.5μin (0.75μm) |
| Contact Material Mating | - | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | - |
| Contact Material Post | - | - | Brass |