PartNumber | 625-25ABT4 | 625-25ABT5 | 625-25ABT4E |
Description | Heat Sinks Omnidirectional Pin Fin Heatsink for 25mm BGA, 25x6.4mm, Chomerics T410 | Heat Sinks Omnidirectional Pin Fin Heatsink for 25mm BGA, 25x6.4mm, Chomerics T411 | HEATSINK CPU 25MM SQ W/DBL TAPE |
Manufacturer | Wakefield-Vette | Wakefield-Vette | Wakefield-Vette |
Product Category | Heat Sinks | Heat Sinks | Thermal - Heat Sinks |
RoHS | N | Y | - |
Product | Heat Sinks | - | - |
Mounting Style | Adhesive | Adhesive | - |
Heatsink Material | Aluminum | Aluminum | - |
Fin Style | Omnidirectional Fin | Omnidirectional Fin | - |
Length | 25 mm | - | 0.984" (25.00mm) |
Width | 25 mm | - | 0.984" (25.00mm) |
Height | 6.35 mm | - | - |
Designed for | BGA, Super BGA, PBGA, FPBGA | BGA, Super BGA, PBGA, FPBGA | - |
Color | Black | Black | - |
Series | 625 | 625 | 625 |
Type | Top Mount | Top Mount | Top Mount |
Brand | Wakefield-Vette | Wakefield-Vette | - |
Product Type | Heat Sinks | Heat Sinks | - |
Factory Pack Quantity | 1600 | 1600 | - |
Subcategory | Heat Sinks | Heat Sinks | - |
Material | - | - | Aluminum |
Shape | - | - | Square, Pin Fins |
Diameter | - | - | - |
Package Cooled | - | - | BGA |
Attachment Method | - | - | Thermal Tape, Adhesive (Included) |
Height Off Base Height of Fin | - | - | 0.250" (6.35mm) |
Power Dissipation Temperature Rise | - | - | - |
Thermal Resistance Forced Air Flow | - | - | 12°C/W @ 500 LFM |
Thermal Resistance Natural | - | - | - |
Material Finish | - | - | Black Anodized |