 | | | |
| PartNumber | BU220 | BU2207FV-E1 | BU221 |
| Description | |||
| Manufacturer | On Shore Technology Inc. | - | - |
| Product Category | Sockets for ICs, Transistors | - | - |
| Series | BU-178HT | - | - |
| Type | DIP, 0.4" (10.16mm) Row Spacing | - | - |
| Packaging | Tube | - | - |
| Termination | Solder | - | - |
| Operating Temperature | -55°C ~ 125°C | - | - |
| Mounting Type | Surface Mount | - | - |
| Features | Open Frame | - | - |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled | - | - |
| Number of Positions or Pins Grid | 22 (2 x 11) | - | - |
| Pitch Mating | 0.100" (2.54mm) | - | - |
| Contact Finish Mating | Gold | - | - |
| Pitch Post | 0.100" (2.54mm) | - | - |
| Contact Finish Post | Copper | - | - |
| Contact Finish Thickness Mating | 78.7μin (2.00μm) | - | - |
| Contact Material Mating | Beryllium Copper | - | - |
| Contact Finish Thickness Post | Flash | - | - |
| Contact Material Post | Brass | - | - |