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| PartNumber | 115-43-324-61-001000 | 115-43-324-41-001000 | 115-43-324-41-003000 |
| Description | IC & Component Sockets DIP Dual In Line Socket | IC & Component Sockets 24P VERY LOW PROFILE | IC & Component Sockets 24P TIN PIN GLD CONT |
| Manufacturer | Mill-Max | Mill-Max Manufacturing Corp. | - |
| Product Category | IC & Component Sockets | Sockets for ICs, Transistors | - |
| RoHS | Y | - | - |
| Series | 0115 | 115 | - |
| Packaging | Tube | Tube | - |
| Brand | Mill-Max | - | - |
| Product Type | IC & Component Sockets | - | - |
| Factory Pack Quantity | 16 | - | - |
| Subcategory | IC & Component Sockets | - | - |
| Type | - | DIP, 0.3" (7.62mm) Row Spacing | - |
| Termination | - | Solder | - |
| Operating Temperature | - | -55°C ~ 125°C | - |
| Mounting Type | - | Through Hole | - |
| Features | - | Open Frame | - |
| Housing Material | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
| Number of Positions or Pins Grid | - | 24 (2 x 12) | - |
| Pitch Mating | - | 0.100" (2.54mm) | - |
| Contact Finish Mating | - | Gold | - |
| Pitch Post | - | 0.100" (2.54mm) | - |
| Contact Finish Post | - | Tin | - |
| Contact Finish Thickness Mating | - | 30μin (0.76μm) | - |
| Contact Material Mating | - | Beryllium Copper | - |
| Contact Finish Thickness Post | - | 200μin (5.08μm) | - |
| Contact Material Post | - | Brass Alloy | - |
| Hersteller | Teil # | Beschreibung | RFQ |
|---|---|---|---|
Mill-Max |
115-43-324-61-001000 | IC & Component Sockets DIP Dual In Line Socket | |
| 115-43-324-61-003000 | IC & Component Sockets DIP Dual In Line Socket | ||
| 115-43-324-41-001000 | IC & Component Sockets 24P VERY LOW PROFILE | ||
| 115-43-324-41-003000 | IC & Component Sockets 24P TIN PIN GLD CONT |