PartNumber | 116-93-650-41-006000 | 116-93-650-41-001000 | 116-93-650-41-003000 |
Description | IC & Component Sockets 50 PIN ELEVATED SKT .236L | IC & Component Sockets 50 PIN ELEVATED SKT .594L | IC & Component Sockets 50 PIN ELEVATED SKT .315L |
Manufacturer | Mill-Max | Mill-Max Manufacturing Corp. | Mill-Max Manufacturing Corp. |
Product Category | IC & Component Sockets | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
RoHS | N | - | - |
Series | 0116 | 116 | 116 |
Packaging | Tube | Tube | Tube |
Brand | Mill-Max | - | - |
Product Type | IC & Component Sockets | - | - |
Factory Pack Quantity | 8 | - | - |
Subcategory | IC & Component Sockets | - | - |
Type | - | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing |
Termination | - | Solder | Solder |
Operating Temperature | - | -55°C ~ 125°C | -55°C ~ 125°C |
Mounting Type | - | Through Hole | Through Hole |
Features | - | Elevated, Open Frame | Elevated, Open Frame |
Housing Material | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Number of Positions or Pins Grid | - | 50 (2 x 25) | 50 (2 x 25) |
Pitch Mating | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
Contact Finish Mating | - | Gold | Gold |
Pitch Post | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
Contact Finish Post | - | Tin-Lead | Tin-Lead |
Contact Finish Thickness Mating | - | 30μin (0.76μm) | 30μin (0.76μm) |
Contact Material Mating | - | Beryllium Copper | Beryllium Copper |
Contact Finish Thickness Post | - | 200μin (5.08μm) | 200μin (5.08μm) |
Contact Material Post | - | Brass Alloy | Brass Alloy |