2-64046

2-640463-4 vs 2-640464-2 vs 2-640463-2

 
PartNumber2-640463-42-640464-22-640463-2
DescriptionIC & Component Sockets 8P CLOSED FRAME GOLD 5200IC & Component Sockets 20C DIPLOMATE DL SKT 2100IC & Component Sockets DIP-8 IC SOCKET 5200
ManufacturerTE ConnectivityTE ConnectivityTE Connectivity AMP Connectors
Product CategoryIC & Component SocketsIC & Component SocketsSockets for ICs, Transistors
RoHSEN-
ProductDIP / SIP SocketsDIP / SIP Sockets-
Number of Positions8 Position--
TypeClosed Frame-DIP, 0.3" (7.62mm) Row Spacing
Pitch2.54 mm--
Termination StyleThrough Hole--
Contact PlatingGoldGold-
Row Spacing7.62 mm--
FeaturesDIP socket-Closed Frame
BrandTE Connectivity / AMPTE Connectivity / AMP-
Contact MaterialGold--
Product TypeIC & Component SocketsIC & Component Sockets-
Factory Pack Quantity5221-
SubcategoryIC & Component SocketsIC & Component Sockets-
Unit Weight0.035591 oz--
Part # Aliases-2-640464-2-
Series--Diplomate DL
Packaging--Tube
Termination--Solder
Operating Temperature---55°C ~ 125°C
Mounting Type--Through Hole
Housing Material--Thermoplastic, Glass Filled
Number of Positions or Pins Grid--8 (2 x 4)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Gold
Contact Finish Thickness Mating--30μin (0.76μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--30μin (0.76μm)
Contact Material Post--Beryllium Copper
Hersteller Teil # Beschreibung RFQ
TE Connectivity / AMP Connectors
TE Connectivity / AMP Connectors
2-640464-4 IC & Component Sockets 20 CLOSED FRAME GOLD
2-640463-4 IC & Component Sockets 8P CLOSED FRAME GOLD 5200
2-640464-2 IC & Component Sockets 20C DIPLOMATE DL SKT 2100
TE Connectivity
TE Connectivity
2-640464-2 IC & Component Sockets 20C DIPLOMATE DL SKT 2100
2-640464-4 IC & Component Sockets 20 CLOSED FRAME GOLD
2-640463-2 IC & Component Sockets DIP-8 IC SOCKET 5200
2-640463-4 CONN IC DIP SOCKET 8POS GOLD
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