PartNumber | 24-3574-16 | 24-3574-11 | 24-3574-10 |
Description | IC & Component Sockets QUICK RELEASE 24 PIN NICKEL | IC & Component Sockets QUICK RELEASE 24 PIN GOLD | IC & Component Sockets QUICK RELEASE 24 PIN TIN |
Manufacturer | Aries Electronics | Aries Electronics | Aries Electronics |
Product Category | IC & Component Sockets | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
RoHS | Y | - | - |
Product | Zero Insertion Force (ZIF) Sockets | - | - |
Number of Positions | 24 Position | - | - |
Contact Plating | Nickel Boron | - | - |
Series | X57X | 57 | 57 |
Brand | Aries Electronics | - | - |
Mounting Style | PCB | - | - |
Product Type | IC & Component Sockets | - | - |
Factory Pack Quantity | 12 | - | - |
Subcategory | IC & Component Sockets | - | - |
Type | - | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Packaging | - | Bulk | Bulk |
Termination | - | Solder | Solder |
Operating Temperature | - | - | - |
Mounting Type | - | Through Hole | Through Hole |
Features | - | Closed Frame | Closed Frame |
Housing Material | - | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled |
Number of Positions or Pins Grid | - | 24 (2 x 12) | 24 (2 x 12) |
Pitch Mating | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
Contact Finish Mating | - | Tin | Tin |
Pitch Post | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
Contact Finish Post | - | Tin | Tin |
Contact Finish Thickness Mating | - | 200μin (5.08μm) | 200μin (5.08μm) |
Contact Material Mating | - | Beryllium Copper | Beryllium Copper |
Contact Finish Thickness Post | - | 200μin (5.08μm) | 200μin (5.08μm) |
Contact Material Post | - | Beryllium Copper | Beryllium Copper |