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| PartNumber | 24-6554-16 | 24-6554-11 | 24-6554-10 |
| Description | IC & Component Sockets DIP TEST SOCKET | IC & Component Sockets 24 PIN W/HANDLE | IC & Component Sockets 24P TEST SOCKET TIN |
| Manufacturer | Aries Electronics | Aries Electronics | - |
| Product Category | Sockets for ICs, Transistors | Sockets for ICs, Transistors | - |
| Series | 55 | 55 | - |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | - |
| Packaging | Bulk | Bulk | - |
| Termination | Solder | Solder | - |
| Operating Temperature | - | - | - |
| Mounting Type | Through Hole | Through Hole | - |
| Features | Closed Frame | Closed Frame | - |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | - |
| Number of Positions or Pins Grid | 24 (2 x 12) | 24 (2 x 12) | - |
| Pitch Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | - |
| Contact Finish Mating | Nickel Boron | Gold | - |
| Pitch Post | 0.100" (2.54mm) | 0.100" (2.54mm) | - |
| Contact Finish Post | Nickel Boron | Gold | - |
| Contact Finish Thickness Mating | 50μin (1.27μm) | - | - |
| Contact Material Mating | Beryllium Copper | Beryllium Copper | - |
| Contact Finish Thickness Post | 50μin (1.27μm) | - | - |
| Contact Material Post | Beryllium Copper | Beryllium Copper | - |