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| PartNumber | 268-5401-52-1102J | 268-5401-52-1102JH | 268-5401-52-0000 |
| Description | IC & Component Sockets TYPE"A" LCC W/FINNED HEAT SINK | IC & Component Sockets LID- 6MM HEAT SINK 24.13+/-0.25 | |
| Manufacturer | - | 3M | - |
| Product Category | - | Sockets for ICs, Transistors | - |
| Series | - | OEM | - |
| Type | - | CLCC | - |
| Packaging | - | Tray | - |
| Termination | - | Solder | - |
| Operating Temperature | - | -55°C ~ 105°C | - |
| Mounting Type | - | Through Hole | - |
| Features | - | Closed Frame | - |
| Housing Material | - | Polyphenylene Sulfide (PPS), Glass Filled | - |
| Number of Positions or Pins Grid | - | 68 (4 x 17) | - |
| Pitch Mating | - | 0.100" (2.54mm) | - |
| Contact Finish Mating | - | Gold | - |
| Pitch Post | - | 0.100" (2.54mm) | - |
| Contact Finish Post | - | Gold | - |
| Contact Finish Thickness Mating | - | 30μin (0.76μm) | - |
| Contact Material Mating | - | Beryllium Copper | - |
| Contact Finish Thickness Post | - | 30μin (0.76μm) | - |
| Contact Material Post | - | Beryllium Copper | - |