PartNumber | 48-3575-11 | 48-3575-16 | 48-3575-10 |
Description | IC & Component Sockets QUICK RELEASE 48 PIN GOLD | IC & Component Sockets QUICK RELEASE 48 PIN NICKEL | IC & Component Sockets QUICK RELEASE 48 PIN TIN |
Manufacturer | Aries Electronics | - | Aries Electronics |
Product Category | IC & Component Sockets | - | Sockets for ICs, Transistors |
RoHS | Y | - | - |
Product | Zero Insertion Force (ZIF) Sockets | - | - |
Number of Positions | 48 Position | - | - |
Contact Plating | Gold | - | - |
Series | X57X | - | 57 |
Brand | Aries Electronics | - | - |
Mounting Style | PCB | - | - |
Product Type | IC & Component Sockets | - | - |
Factory Pack Quantity | 6 | - | - |
Subcategory | IC & Component Sockets | - | - |
Type | - | - | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Packaging | - | - | Bulk |
Termination | - | - | Solder |
Operating Temperature | - | - | - |
Mounting Type | - | - | Through Hole |
Features | - | - | Closed Frame |
Housing Material | - | - | Polyphenylene Sulfide (PPS), Glass Filled |
Number of Positions or Pins Grid | - | - | 48 (2 x 24) |
Pitch Mating | - | - | 0.100" (2.54mm) |
Contact Finish Mating | - | - | Tin |
Pitch Post | - | - | 0.100" (2.54mm) |
Contact Finish Post | - | - | Tin |
Contact Finish Thickness Mating | - | - | 200μin (5.08μm) |
Contact Material Mating | - | - | Beryllium Copper |
Contact Finish Thickness Post | - | - | 200μin (5.08μm) |
Contact Material Post | - | - | Beryllium Copper |