 | | | |
| PartNumber | 514-87-352M26-001148 | 514-87-356M26-001148 | 514-87-357M19-001148 |
| Description | CONN SOCKET BGA 352POS GOLD | CONN SOCKET BGA 356POS GOLD | CONN SOCKET BGA 357POS GOLD |
| Manufacturer | Preci-Dip | - | Preci-Dip |
| Product Category | Sockets for ICs, Transistors | - | Sockets for ICs, Transistors |
| Series | 514 | - | 514 |
| Type | BGA | - | BGA |
| Packaging | Bulk | - | Bulk |
| Termination | Solder | - | Solder |
| Operating Temperature | -55°C ~ 125°C | - | -55°C ~ 125°C |
| Mounting Type | Surface Mount | - | Surface Mount |
| Features | Open Frame | - | Open Frame |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Number of Positions or Pins Grid | 352 (26 x 26) | - | 357 (19 x 19) |
| Pitch Mating | 0.100" (2.54mm) | - | 0.100" (2.54mm) |
| Contact Finish Mating | Gold | - | Gold |
| Pitch Post | 0.100" (2.54mm) | - | 0.100" (2.54mm) |
| Contact Finish Post | Tin | - | Tin |
| Contact Finish Thickness Mating | Flash | - | Flash |
| Contact Material Mating | Beryllium Copper | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | - |
| Contact Material Post | Brass | - | Brass |
| Hersteller | Teil # | Beschreibung | RFQ |
|---|---|---|---|
Preci-Dip |
514-87-352M26-001148 | CONN SOCKET BGA 352POS GOLD | |
| 514-87-356M26-001148 | CONN SOCKET BGA 356POS GOLD | ||
| 514-87-357M19-001148 | CONN SOCKET BGA 357POS GOLD |