PartNumber | 658-35ABT1E | 658-35ABT4 | 658-35ABT3 |
Description | Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA & Power PC | Heat Sinks Omnidirectional Pin Fin Heatsink for 27mm BGA and PowerPC, Aluminum, Black Anodized, Chomerics T410 | HEATSINK CPU 28MM SQ BLK W/TAPE |
Manufacturer | Wakefield-Vette | Wakefield-Vette | Wakefield-Vette |
Product Category | Heat Sinks | Heat Sinks | Thermal - Heat Sinks |
Brand | Wakefield-Vette | Wakefield-Vette | - |
Product Type | Heat Sinks | Heat Sinks | - |
Subcategory | Heat Sinks | Heat Sinks | - |
RoHS | - | N | - |
Product | - | Heat Sinks | Heat Sinks |
Mounting Style | - | Adhesive | SMD/SMT |
Heatsink Material | - | Aluminum | Aluminum |
Fin Style | - | Omnidirectional Fin | Omnidirectional Fin |
Length | - | 27.94 mm | 1.100" (27.94mm) |
Width | - | 27.94 mm | 1.100" (27.94mm) |
Height | - | 8.89 mm | 8.89 mm |
Designed for | - | BGA, Super BGA, PBGA, FPBGA, PowerPC | BGA Super BGA PBGA FPBGA PowerPC |
Color | - | Black | Black |
Series | - | 658 | 658 |
Type | - | Top Mount | Top Mount |
Factory Pack Quantity | - | 1000 | - |
Material | - | - | Aluminum |
Shape | - | - | Square, Pin Fins |
Diameter | - | - | - |
Package Cooled | - | - | BGA |
Attachment Method | - | - | Thermal Tape, Adhesive (Included) |
Height Off Base Height of Fin | - | - | 0.350" (8.89mm) |
Power Dissipation Temperature Rise | - | - | - |
Thermal Resistance Forced Air Flow | - | - | 3.0°C/W @ 800 LFM |
Thermal Resistance Natural | - | - | - |
Material Finish | - | - | Black Anodized |