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B82498F

B82498F3829K1

 
PartNumberB82498F3829K1
DescriptionInd Chip Molded Wirewound 8.2nH 10% 250MHz 50Q-Factor Ceramic 700mA 0805 Blister T/R (Alt: B82498F3829K001)
Hersteller Teil # Beschreibung RFQ
B82498F3829K1 Ind Chip Molded Wirewound 8.2nH 10% 250MHz 50Q-Factor Ceramic 700mA 0805 Blister T/R (Alt: B82498F3829K001)
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