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| PartNumber | B82498F3820G | B82498F3820J | B82498F3820J1 |
| Description | Ind Chip Molded Wirewound 82nH 2% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R (Alt: B82498F3820G000) | Fixed Inductors 82nH 500mA 5% 2.3x1.7mm SMD | Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R - Tape and Reel (Alt: B82498F3820J1) |
| Manufacturer | - | EPCOS (TDK) | - |
| Product Category | - | Fixed Inductors | - |
| Series | - | SIMID | - |
| Type | - | Wirewound | - |
| Packaging | - | Digi-ReelR Alternate Packaging | - |
| Current Rating | - | 500mA | - |
| Package Case | - | 0805 (2012 Metric) | - |
| Operating Temperature | - | - | - |
| Mounting Type | - | Surface Mount | - |
| Size Dimension | - | 0.091" L x 0.067" W (2.30mm x 1.70mm) | - |
| Tolerance | - | ±5% | - |
| Height Seated Max | - | 0.055" (1.40mm) | - |
| Ratings | - | AEC-Q200 | - |
| Shielding | - | Unshielded | - |
| Inductance | - | 82nH | - |
| DC Resistance DCR | - | 190 mOhm Max | - |
| Material Core | - | Ceramic | - |
| Current Saturation | - | - | - |
| Q Freq | - | 60 @ 500MHz | - |
| Frequency Self Resonant | - | 1.5GHz | - |
| Frequency Test | - | 150MHz | - |
| Hersteller | Teil # | Beschreibung | RFQ |
|---|---|---|---|
| B82498F3820G | Ind Chip Molded Wirewound 82nH 2% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R (Alt: B82498F3820G000) | ||
| B82498F3821J | Fixed Inductors 820nH 180mA 5% 2.3x1.7mm SMD | ||
| B82498F3820J | Fixed Inductors 82nH 500mA 5% 2.3x1.7mm SMD | ||
| B82498F3829K | Fixed Inductors 8.2nH 700mA 10% 2.3x1.7mm SMD | ||
| B82498F3829K1 | Ind Chip Molded Wirewound 8.2nH 10% 250MHz 50Q-Factor Ceramic 700mA 0805 Blister T/R (Alt: B82498F3829K001) | ||
| B82498F3821J1 | Ind Chip Molded Wirewound 820nH 5% 25MHz 23Q-Factor Ceramic 180mA 0805 Blister T/R - Tape and Reel (Alt: B82498F3821J1) | ||
| B82498F3820J1 | Ind Chip Molded Wirewound 82nH 5% 150MHz 60Q-Factor Ceramic 500mA 0805 Blister T/R - Tape and Reel (Alt: B82498F3820J1) | ||
EPCOS / TDK |
B82498F3820J000 | FIXED IND 82NH 500MA 190 MOHM | |
| B82498F3821J000 | Inductor Chip Molded Wirewound 820nH 5% 25MHz 23Q-Factor Ceramic 180mA 1.9Ohm DCR 0805 Automotive Blister T/R | ||
| B82498F3829K000 | FIXED IND 8.2NH 700MA 90 MOHM | ||
| B82498F3820G000 | Fixed Inductors SMT-INDUCTOR 0805 82NH 2% | ||
| B82498F3820G001 | Fixed Inductors SMT-INDUCTOR 0805 82NH 2% | ||
| B82498F3821G001 | Fixed Inductors SMT-INDUCTOR 0805 820NH 2% | ||
| B82498F3820J001 | Fixed Inductors SMT-INDUCTOR 0805 82NH 5% | ||
| B82498F3829K001 | Fixed Inductors SMT-INDUCTOR 0805 8.2NH 10% | ||
| B82498F3821G000 | Fixed Inductors SMT-INDUCTOR 0805 820NH 2% | ||
| B82498F3821J001 | Fixed Inductors SMT-INDUCTOR 0805 820NH 5% |