 | | | |
| PartNumber | H6161 | H6161P | H6161P YY900 |
| Description | |||
| Manufacturer | Amphenol FCI | HELIQS | - |
| Product Category | Terminal Blocks - Wire to Board | IC Chips | - |
| Color | Gray | - | - |
| Series | H6 | - | - |
| Packaging | Bulk | - | - |
| Mounting Type | Through Hole | - | - |
| Features | - | - | - |
| Current | 11A | - | - |
| Voltage | 300V | - | - |
| Wire Gauge | 12-20 AWG | - | - |
| Pitch | 0.295" (7.50mm) | - | - |
| Number of Levels | 1 | - | - |
| Positions Per Level | 16 | - | - |
| Mating Orientation | Horizontal with Board | - | - |
| Wire Termination | Screwless - Push Button Clamp | - | - |