| PartNumber | MCR18EZPF3302 | MCR18EZPF3300 | MCR18EZPF3301 |
| Description | RES SMD 33K OHM 1% 1/4W 1206 | Res Thick Film 1206 330 Ohm 1% 0.25W(1/4W) ±100ppm/C Molded SMD Automotive Paper T/R | RES SMD 3.3K OHM 1% 1/4W 1206 |
| Manufacturer | Rohm Semiconductor | - | Rohm Semiconductor |
| Product Category | Chip Resistor - Surface Mount | - | Chip Resistor - Surface Mount |
| Series | MCR | - | MCR |
| Packaging | Digi-ReelR Alternate Packaging | - | Digi-ReelR Alternate Packaging |
| Height | 0.026" (0.65mm) | - | 0.026" (0.65mm) |
| Package Case | 1206 (3216 Metric) | - | 1206 (3216 Metric) |
| Operating Temperature | -55°C ~ 155°C | - | -55°C ~ 155°C |
| Features | Automotive AEC-Q200 | - | Automotive AEC-Q200 |
| Size Dimension | 0.126" L x 0.063" W (3.20mm x 1.60mm) | - | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Supplier Device Package | - | ||
| Power Watts | 0.25W, 1/4W | - | 0.25W, 1/4W |
| Resistance Ohms | 33k | - | 3.3k |
| Tolerance | ±1% | - | ±1% |
| Number of Terminations | 2 | - | 2 |
| Temperature Coefficient | ±100ppm/°C | - | ±100ppm/°C |
| Composition | Thick Film | - | Thick Film |
| Failure Rate | - | - | - |