2144425

2144425
Mfr. #:
2144425
Hersteller:
Cypress Semiconductor
Beschreibung:
IC FLASH MEMORY
Lebenszyklus:
Neu von diesem Hersteller.
Datenblatt:
2144425 Datenblatt
Die Zustellung:
DHL FedEx Ups TNT EMS
Zahlung:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Mehr Informationen:
2144425 Mehr Informationen 2144425 Product Details
Produkteigenschaft
Attributwert
Tags
21444, 2144, 214
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
Teil # Mfg. Beschreibung Aktie Preis
2144425
DISTI # 2144425-ND
Cypress SemiconductorIC FLASH MEMORY
RoHS: Compliant
Min Qty: 1600
Container: Bulk
Limited Supply - Call
    1858109Phoenix ContactPluggable Terminal Blocks 9 Pos 3.81mm Invert Plug 28-16AWG Screw
    RoHS: Compliant
    Americas -
    • 50:$10.8400
    • 100:$10.1300
    • 250:$9.6200
    • 500:$9.1400
    Bild Teil # Beschreibung
    2142

    Mfr.#: 2142

    OMO.#: OMO-2142

    Fiber Optic Connectors CHEST BOX (2142)
    2142970-5

    Mfr.#: 2142970-5

    OMO.#: OMO-2142970-5

    Ethernet Cables / Networking Cables MICRO SFP+-STD SFP+ 4M, 26AWG
    214912

    Mfr.#: 214912

    OMO.#: OMO-214912-418

    Board to Board & Mezzanine Connectors 5P 4MM HP FML VERT SMT/THR B-B MEZZ
    214-99-628-01-670799

    Mfr.#: 214-99-628-01-670799

    OMO.#: OMO-214-99-628-01-670799-408

    IC & Component Sockets 28P DIP SMD T/R
    214-120(TO-18/TO-5TRANSI

    Mfr.#: 214-120(TO-18/TO-5TRANSI

    OMO.#: OMO-214-120-TO-18-TO-5TRANSI-1190

    Neu und Original
    2141608-6

    Mfr.#: 2141608-6

    OMO.#: OMO-2141608-6-1190

    Neu und Original
    2143SV11FA

    Mfr.#: 2143SV11FA

    OMO.#: OMO-2143SV11FA-1190

    Neu und Original
    214820

    Mfr.#: 214820

    OMO.#: OMO-214820-1190

    Neu und Original
    2149905-6

    Mfr.#: 2149905-6

    OMO.#: OMO-2149905-6-1190

    Neu und Original
    214A532-25-0

    Mfr.#: 214A532-25-0

    OMO.#: OMO-214A532-25-0-TE-CONNECTIVITY

    214A532-25-0
    Verfügbarkeit
    Aktie:
    Available
    Auf Bestellung:
    3500
    Menge eingeben:
    Der aktuelle Preis von 2144425 dient nur als Referenz. Wenn Sie den besten Preis erhalten möchten, senden Sie bitte eine Anfrage oder senden Sie eine direkte E-Mail an unser Verkaufsteam [email protected]
    Referenzpreis (USD)
    Menge
    Stückpreis
    ext. Preis
    1
    0,00 $
    0,00 $
    10
    0,00 $
    0,00 $
    100
    0,00 $
    0,00 $
    500
    0,00 $
    0,00 $
    1000
    0,00 $
    0,00 $
    Beginnen mit
    Neueste Produkte
    • PSoC® 4 BLE 256 KB Module with Bluetooth®
      Cypress' PSoC 4 BLE 256 KB device, two crystals for the antenna matching network, a PCB antenna and other passives, while providing access to all GPIOs of the device.
    • T543 Series COTS Polymer Electrolytic
      KEMET Organic Capacitor (KO-CAP) is a solid electrolytic capacitor with a conductive polymer cathode capable of delivering low ESR and capacitance retention at high frequencies.
    • HK Series Inductors
      TAIYO YUDEN's HK series inductors have expanded to include price competitive, AEC-Q200 qualified high-reliability version inductors.
    • Piezoelectric Acoustic Modules
      KEMET's multilayer piezoelectric bimorph actuators are ceramic elements used to convert electrical energy into mechanical energy such as displacement or force.
    • CY8CKIT-042-BLE Bluetooth® Low Energy Develop
      The Cypress CY8CKIT-042-BLE development kit supports system-level designs including example projects to enable Bluetooth Low Energy mixed-signal embedded designs.
    Top